JPS6429894U - - Google Patents
Info
- Publication number
- JPS6429894U JPS6429894U JP12498387U JP12498387U JPS6429894U JP S6429894 U JPS6429894 U JP S6429894U JP 12498387 U JP12498387 U JP 12498387U JP 12498387 U JP12498387 U JP 12498387U JP S6429894 U JPS6429894 U JP S6429894U
- Authority
- JP
- Japan
- Prior art keywords
- electronic
- electronic device
- gas
- substrates
- gas header
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 4
Landscapes
- Rolls And Other Rotary Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案による電子装置の冷却装置の
一実施例を示す要部断面図、第２図は第１図のノ
ズル先端部分を示す拡大図、第３図はこの考案に
よる電子装置の冷却装置の気体ヘツダの部分斜視
図、第４図は従来の電子装置の冷却装置を示す要
部断面図である。なお図中同一符号は同一または
相当部分を示す。
Fig. 1 is a sectional view of a main part showing an embodiment of a cooling device for an electronic device according to this invention, Fig. 2 is an enlarged view showing the tip of the nozzle in Fig. 1, and Fig. 3 is a cooling device for an electronic device according to this invention. FIG. 4 is a partial perspective view of a gas header of the device, and FIG. 4 is a sectional view of a main part showing a conventional cooling device for an electronic device. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
向するように複数配列してなるる電子装置と、こ
の電子装置における上記基板の端面部に設けられ
配管を介して圧縮気体の供給を受ける気体ヘツダ
と、この気体ヘツダの上記基板側の面部でかつそ
の基板相互間の上記間隙部に複数設けられ上記圧
縮気体を吹き出する吹出口とを備えてなることを
特徴とする電子装置の冷却装置。 (2) 吹出口はその一部が電子部品の近傍に位置
していることを特徴とする実用新案登録請求の範
囲第(1)項記載の電子装置の冷却装置。[Claims for Utility Model Registration] (1) An electronic device in which a plurality of substrates on which electronic components are mounted are arranged facing each other with gaps, and piping provided on the end face of the substrate in this electronic device. a gas header that receives compressed gas through the gas header; and a plurality of blow-off ports that are provided on the surface of the gas header on the substrate side and in the gap between the substrates and blow out the compressed gas. A cooling device for electronic devices characterized by: (2) The cooling device for an electronic device according to claim (1) of the utility model registration, wherein a part of the air outlet is located near an electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12498387U JPS6429894U (en) | 1987-08-17 | 1987-08-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12498387U JPS6429894U (en) | 1987-08-17 | 1987-08-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6429894U true JPS6429894U (en) | 1989-02-22 |
Family
ID=31375185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12498387U Pending JPS6429894U (en) | 1987-08-17 | 1987-08-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6429894U (en) |
-
1987
- 1987-08-17 JP JP12498387U patent/JPS6429894U/ja active Pending
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