JPS6429885U - - Google Patents
Info
- Publication number
- JPS6429885U JPS6429885U JP12318087U JP12318087U JPS6429885U JP S6429885 U JPS6429885 U JP S6429885U JP 12318087 U JP12318087 U JP 12318087U JP 12318087 U JP12318087 U JP 12318087U JP S6429885 U JPS6429885 U JP S6429885U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- conductive pattern
- wire bonding
- pattern type
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987123180U JPH0513011Y2 (zh) | 1987-08-13 | 1987-08-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987123180U JPH0513011Y2 (zh) | 1987-08-13 | 1987-08-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6429885U true JPS6429885U (zh) | 1989-02-22 |
| JPH0513011Y2 JPH0513011Y2 (zh) | 1993-04-06 |
Family
ID=31371794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987123180U Expired - Lifetime JPH0513011Y2 (zh) | 1987-08-13 | 1987-08-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0513011Y2 (zh) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5629963U (zh) * | 1979-08-15 | 1981-03-23 | ||
| JPS58118739U (ja) * | 1982-02-05 | 1983-08-13 | 富士電機株式会社 | ボンデイングブロツク |
| JPS58151039A (ja) * | 1982-03-04 | 1983-09-08 | Denki Kagaku Kogyo Kk | 混成集積回路基板 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5629963B2 (zh) * | 1975-02-21 | 1981-07-11 |
-
1987
- 1987-08-13 JP JP1987123180U patent/JPH0513011Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5629963U (zh) * | 1979-08-15 | 1981-03-23 | ||
| JPS58118739U (ja) * | 1982-02-05 | 1983-08-13 | 富士電機株式会社 | ボンデイングブロツク |
| JPS58151039A (ja) * | 1982-03-04 | 1983-09-08 | Denki Kagaku Kogyo Kk | 混成集積回路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0513011Y2 (zh) | 1993-04-06 |