JPS6428856U - - Google Patents

Info

Publication number
JPS6428856U
JPS6428856U JP12413587U JP12413587U JPS6428856U JP S6428856 U JPS6428856 U JP S6428856U JP 12413587 U JP12413587 U JP 12413587U JP 12413587 U JP12413587 U JP 12413587U JP S6428856 U JPS6428856 U JP S6428856U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12413587U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12413587U priority Critical patent/JPS6428856U/ja
Publication of JPS6428856U publication Critical patent/JPS6428856U/ja
Application status is Pending legal-status Critical

Links

JP12413587U 1987-08-13 1987-08-13 Pending JPS6428856U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12413587U JPS6428856U (en) 1987-08-13 1987-08-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12413587U JPS6428856U (en) 1987-08-13 1987-08-13

Publications (1)

Publication Number Publication Date
JPS6428856U true JPS6428856U (en) 1989-02-21

Family

ID=31373605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12413587U Pending JPS6428856U (en) 1987-08-13 1987-08-13

Country Status (1)

Country Link
JP (1) JPS6428856U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7371612B2 (en) 1996-05-20 2008-05-13 Micron Technology, Inc. Method of fabrication of stacked semiconductor devices
US7485490B2 (en) 2001-03-09 2009-02-03 Amkor Technology, Inc. Method of forming a stacked semiconductor package

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594265B2 (en) * 1978-12-26 1984-01-28 Motoda Denshi Kogyo Kk

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594265B2 (en) * 1978-12-26 1984-01-28 Motoda Denshi Kogyo Kk

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7371612B2 (en) 1996-05-20 2008-05-13 Micron Technology, Inc. Method of fabrication of stacked semiconductor devices
US7485490B2 (en) 2001-03-09 2009-02-03 Amkor Technology, Inc. Method of forming a stacked semiconductor package

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