JPS6428856U - - Google Patents
Info
- Publication number
- JPS6428856U JPS6428856U JP12413587U JP12413587U JPS6428856U JP S6428856 U JPS6428856 U JP S6428856U JP 12413587 U JP12413587 U JP 12413587U JP 12413587 U JP12413587 U JP 12413587U JP S6428856 U JPS6428856 U JP S6428856U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- equipment according
- protective equipment
- frames
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims description 5
Landscapes
- Protection Of Plants (AREA)
Description
図面は本考案に係る防護具の一実施例を示し、
第1図は組み立てた状態の斜視図、第2図はフレ
ーム同志を折り畳んだ状態の正面図、第3図はフ
レームを分解した状態の斜視図、第4図a,bは
フレームを枠部に取り付けた状態の斜視図である
。
符号1,2はフレーム、1a,2aは頂辺、1
b,2bは先端部、3はネツト、4は軸、5は枠
材、6は四角枠である。
The drawing shows an example of the protective equipment according to the present invention,
Figure 1 is a perspective view of the assembled state, Figure 2 is a front view of the frame folded together, Figure 3 is a perspective view of the frame disassembled, and Figures 4a and b are the frames attached to the frame. FIG. 3 is a perspective view of the attached state. Codes 1 and 2 are frames, 1a and 2a are top sides, 1
2b and 2b are tips, 3 is a net, 4 is a shaft, 5 is a frame material, and 6 is a square frame.
Claims (1)
が同一方向を向くようにして、これらの頂辺同志
を回動自在に交叉させて固定し、前記頂辺同志を
交叉させた状態でこれらフレーム上に覆いを被せ
るようにしたことを特徴とする防護具。 2 前記覆いは前記フレームに取り付けておくよ
うにした実用新案登録請求の範囲第1項に記載の
防護具。 3 前記フレームは分解できるようにした実用新
案登録請求の範囲第1項に記載の防護具。 4 前記フレームの先端部は枠部に固定するよう
にした実用新案登録請求の範囲第1項に記載の防
護具。[Claims for Utility Model Registration] 1. Two frames each having a substantially U-shape are fixed so that their respective tips face the same direction and their top sides are rotatably intersecting each other, and A protective device characterized in that a cover is placed over these frames with their sides crossed. 2. The protective equipment according to claim 1, wherein the cover is attached to the frame. 3. The protective equipment according to claim 1, wherein the frame is disassembleable. 4. The protective equipment according to claim 1, wherein the distal end of the frame is fixed to the frame.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12413587U JPS6428856U (en) | 1987-08-13 | 1987-08-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12413587U JPS6428856U (en) | 1987-08-13 | 1987-08-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6428856U true JPS6428856U (en) | 1989-02-21 |
Family
ID=31373605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12413587U Pending JPS6428856U (en) | 1987-08-13 | 1987-08-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6428856U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7371612B2 (en) | 1996-05-20 | 2008-05-13 | Micron Technology, Inc. | Method of fabrication of stacked semiconductor devices |
US7485490B2 (en) | 2001-03-09 | 2009-02-03 | Amkor Technology, Inc. | Method of forming a stacked semiconductor package |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS594265B2 (en) * | 1978-12-26 | 1984-01-28 | 元田電子工業株式会社 | Link robot equipment |
-
1987
- 1987-08-13 JP JP12413587U patent/JPS6428856U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS594265B2 (en) * | 1978-12-26 | 1984-01-28 | 元田電子工業株式会社 | Link robot equipment |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7371612B2 (en) | 1996-05-20 | 2008-05-13 | Micron Technology, Inc. | Method of fabrication of stacked semiconductor devices |
US7485490B2 (en) | 2001-03-09 | 2009-02-03 | Amkor Technology, Inc. | Method of forming a stacked semiconductor package |