JPS6428848A - Cooling equipment for semiconductor module - Google Patents

Cooling equipment for semiconductor module

Info

Publication number
JPS6428848A
JPS6428848A JP18445887A JP18445887A JPS6428848A JP S6428848 A JPS6428848 A JP S6428848A JP 18445887 A JP18445887 A JP 18445887A JP 18445887 A JP18445887 A JP 18445887A JP S6428848 A JPS6428848 A JP S6428848A
Authority
JP
Japan
Prior art keywords
pipes
cooling
lcm
liquid
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18445887A
Other languages
Japanese (ja)
Inventor
Kenichi Kasai
Hiroyuki Kojima
Shizuo Zushi
Rintaro Minamitani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP18445887A priority Critical patent/JPS6428848A/en
Publication of JPS6428848A publication Critical patent/JPS6428848A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To make it possible to retain a semiconductor module with a large strength, by installing a liquid-cooling module on a high rigidity branch cooling pipe fixed on one end of a main cooling liquid pipe side. CONSTITUTION:On the top part of a semiconductor module 1, a liquid-cooling module (LCM) 2 is mounted, which is supplied with cooling liquid to cool the module 1. At the top part of LCM 2, two high rigidity branch cooling liquid pipes 5a, 5b are arranged, and retain the LCM 2 via a tube restraining jig 7, and an LCM fixing jig 6. One end of main pipes 12, 13 side of each of the pipes 5a, 5b is fixed to a strut 9 via a pipe retaining member 11. Cooling liquid is supplied via pipes 12, 13, flexible pipes 15a, 15b, an unloading port 14, pipes 5a, 5b, an unloading port 8 and hoses 10a, 10b. Thereby, the cooling pipes can be utilized as retaining bodies, and the retaining with large strength is enabled.
JP18445887A 1987-07-23 1987-07-23 Cooling equipment for semiconductor module Pending JPS6428848A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18445887A JPS6428848A (en) 1987-07-23 1987-07-23 Cooling equipment for semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18445887A JPS6428848A (en) 1987-07-23 1987-07-23 Cooling equipment for semiconductor module

Publications (1)

Publication Number Publication Date
JPS6428848A true JPS6428848A (en) 1989-01-31

Family

ID=16153504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18445887A Pending JPS6428848A (en) 1987-07-23 1987-07-23 Cooling equipment for semiconductor module

Country Status (1)

Country Link
JP (1) JPS6428848A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018501772A (en) * 2014-12-08 2018-01-18 ジョンソン コントロールズ テクノロジー カンパニーＪｏｈｎｓｏｎ Ｃｏｎｔｒｏｌｓ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏｍｐａｎｙ Structural frame cooling manifold

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018501772A (en) * 2014-12-08 2018-01-18 ジョンソン コントロールズ テクノロジー カンパニーＪｏｈｎｓｏｎ Ｃｏｎｔｒｏｌｓ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏｍｐａｎｙ Structural frame cooling manifold
US10462942B2 (en) 2014-12-08 2019-10-29 Johnson Controls Technology Company Structural frame cooling manifold

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