JPS6427222U - - Google Patents
Info
- Publication number
- JPS6427222U JPS6427222U JP12037187U JP12037187U JPS6427222U JP S6427222 U JPS6427222 U JP S6427222U JP 12037187 U JP12037187 U JP 12037187U JP 12037187 U JP12037187 U JP 12037187U JP S6427222 U JPS6427222 U JP S6427222U
- Authority
- JP
- Japan
- Prior art keywords
- heating
- detects
- pressurizing device
- operating position
- pressurizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims 2
- 238000002788 crimping Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12037187U JPH061803Y2 (ja) | 1987-08-07 | 1987-08-07 | 加熱圧着機 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12037187U JPH061803Y2 (ja) | 1987-08-07 | 1987-08-07 | 加熱圧着機 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6427222U true JPS6427222U (enrdf_load_html_response) | 1989-02-16 |
| JPH061803Y2 JPH061803Y2 (ja) | 1994-01-19 |
Family
ID=31366418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12037187U Expired - Lifetime JPH061803Y2 (ja) | 1987-08-07 | 1987-08-07 | 加熱圧着機 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH061803Y2 (enrdf_load_html_response) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0314887A (ja) * | 1989-06-13 | 1991-01-23 | Dainippon Printing Co Ltd | 板片の貼着方法及び装置 |
| US6987283B2 (en) | 1993-03-12 | 2006-01-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device structure |
| US7148094B2 (en) | 1993-06-25 | 2006-12-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for its preparation |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4171950B2 (ja) * | 1999-08-27 | 2008-10-29 | 株式会社ユニテム | ポリウレタンフイルムとポリエチレンフイルムの複合フイルムを被融着板材に熱融着する融着方法及びその熱融着機 |
-
1987
- 1987-08-07 JP JP12037187U patent/JPH061803Y2/ja not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0314887A (ja) * | 1989-06-13 | 1991-01-23 | Dainippon Printing Co Ltd | 板片の貼着方法及び装置 |
| US6987283B2 (en) | 1993-03-12 | 2006-01-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device structure |
| US7391051B2 (en) | 1993-03-12 | 2008-06-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device forming method |
| US7148094B2 (en) | 1993-06-25 | 2006-12-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for its preparation |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH061803Y2 (ja) | 1994-01-19 |