JPS6426847U - - Google Patents
Info
- Publication number
- JPS6426847U JPS6426847U JP12340387U JP12340387U JPS6426847U JP S6426847 U JPS6426847 U JP S6426847U JP 12340387 U JP12340387 U JP 12340387U JP 12340387 U JP12340387 U JP 12340387U JP S6426847 U JPS6426847 U JP S6426847U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- membrane circuit
- metal stem
- bonding
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012528 membrane Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83194—Lateral distribution of the layer connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12340387U JPS6426847U (US20030204162A1-20031030-M00001.png) | 1987-08-11 | 1987-08-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12340387U JPS6426847U (US20030204162A1-20031030-M00001.png) | 1987-08-11 | 1987-08-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6426847U true JPS6426847U (US20030204162A1-20031030-M00001.png) | 1989-02-15 |
Family
ID=31372224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12340387U Pending JPS6426847U (US20030204162A1-20031030-M00001.png) | 1987-08-11 | 1987-08-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6426847U (US20030204162A1-20031030-M00001.png) |
-
1987
- 1987-08-11 JP JP12340387U patent/JPS6426847U/ja active Pending
