JPS6426837U - - Google Patents
Info
- Publication number
- JPS6426837U JPS6426837U JP12265687U JP12265687U JPS6426837U JP S6426837 U JPS6426837 U JP S6426837U JP 12265687 U JP12265687 U JP 12265687U JP 12265687 U JP12265687 U JP 12265687U JP S6426837 U JPS6426837 U JP S6426837U
- Authority
- JP
- Japan
- Prior art keywords
- rod
- resin molding
- molding device
- cavity
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12265687U JPS6426837U (xx) | 1987-08-10 | 1987-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12265687U JPS6426837U (xx) | 1987-08-10 | 1987-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6426837U true JPS6426837U (xx) | 1989-02-15 |
Family
ID=31370787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12265687U Pending JPS6426837U (xx) | 1987-08-10 | 1987-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6426837U (xx) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0397248A (ja) * | 1989-09-11 | 1991-04-23 | Oki Electric Ind Co Ltd | 樹脂封止型半導体装置とその製造方法 |
-
1987
- 1987-08-10 JP JP12265687U patent/JPS6426837U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0397248A (ja) * | 1989-09-11 | 1991-04-23 | Oki Electric Ind Co Ltd | 樹脂封止型半導体装置とその製造方法 |