JPS6425586U - - Google Patents
Info
- Publication number
- JPS6425586U JPS6425586U JP12048087U JP12048087U JPS6425586U JP S6425586 U JPS6425586 U JP S6425586U JP 12048087 U JP12048087 U JP 12048087U JP 12048087 U JP12048087 U JP 12048087U JP S6425586 U JPS6425586 U JP S6425586U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- flange
- mounting part
- end surface
- female threaded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000149 penetrating effect Effects 0.000 claims 1
Landscapes
- Valve Housings (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12048087U JPH0355017Y2 (https=) | 1987-08-07 | 1987-08-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12048087U JPH0355017Y2 (https=) | 1987-08-07 | 1987-08-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6425586U true JPS6425586U (https=) | 1989-02-13 |
| JPH0355017Y2 JPH0355017Y2 (https=) | 1991-12-05 |
Family
ID=31366626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12048087U Expired JPH0355017Y2 (https=) | 1987-08-07 | 1987-08-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0355017Y2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7192872B2 (en) | 2001-09-27 | 2007-03-20 | Tongji University | Method of manufacturing semiconductor device having composite buffer layer |
-
1987
- 1987-08-07 JP JP12048087U patent/JPH0355017Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7192872B2 (en) | 2001-09-27 | 2007-03-20 | Tongji University | Method of manufacturing semiconductor device having composite buffer layer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0355017Y2 (https=) | 1991-12-05 |