JPS6425103U - - Google Patents
Info
- Publication number
- JPS6425103U JPS6425103U JP12018387U JP12018387U JPS6425103U JP S6425103 U JPS6425103 U JP S6425103U JP 12018387 U JP12018387 U JP 12018387U JP 12018387 U JP12018387 U JP 12018387U JP S6425103 U JPS6425103 U JP S6425103U
- Authority
- JP
- Japan
- Prior art keywords
- molding
- mold
- treatment layer
- ceramics
- surface treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims description 6
- 239000002335 surface treatment layer Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
- 239000012778 molding material Substances 0.000 claims 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims 1
Landscapes
- Moulds, Cores, Or Mandrels (AREA)
- Press-Shaping Or Shaping Using Conveyers (AREA)
Description
第１図は本考案の成形用金型の一実施例を示す
断面図、第２図は本考案の成形用金型に施される
表面処理層を示す断面図、第３図は従来の成形用
金型を示す断面図である。
１……ダイス、２……上パンチ、３……下パン
チ、１ｂ……ダイス面、２ｂ……上パンチ面、３
ｂ……下パンチ面、５……表面処理層、５ａ……
ＴｉＣ膜、５ｂ……ＴｉＮ膜、６……基材。
Figure 1 is a sectional view showing an embodiment of the molding die of the present invention, Figure 2 is a sectional view showing a surface treatment layer applied to the molding die of the present invention, and Figure 3 is a sectional view of a conventional molding die. It is a sectional view showing a mold for use. 1...Dice, 2...Top punch, 3...Bottom punch, 1b...Dice surface, 2b...Top punch surface, 3
b...Lower punch surface, 5...Surface treatment layer, 5a...
TiC film, 5b...TiN film, 6... Base material.
Claims (1)
を成形するための金型であつて、少なくとも成形
材料と接する面に、基材側から炭化チタン膜と窒
化チタン膜とが順次積層されてなる表面処理層が
設けられたことを特徴とするセラミツクス成形用
金型。 A mold for molding ceramics containing an organic molding binder, in which at least the surface in contact with the molding material is provided with a surface treatment layer consisting of a titanium carbide film and a titanium nitride film sequentially laminated from the base material side. A mold for molding ceramics, which is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12018387U JPH046883Y2 (en) | 1987-08-05 | 1987-08-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12018387U JPH046883Y2 (en) | 1987-08-05 | 1987-08-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6425103U true JPS6425103U (en) | 1989-02-10 |
| JPH046883Y2 JPH046883Y2 (en) | 1992-02-25 |
Family
ID=31366067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12018387U Expired JPH046883Y2 (en) | 1987-08-05 | 1987-08-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH046883Y2 (en) |
-
1987
- 1987-08-05 JP JP12018387U patent/JPH046883Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH046883Y2 (en) | 1992-02-25 |