JPS6424897U - - Google Patents
Info
- Publication number
- JPS6424897U JPS6424897U JP1987119023U JP11902387U JPS6424897U JP S6424897 U JPS6424897 U JP S6424897U JP 1987119023 U JP1987119023 U JP 1987119023U JP 11902387 U JP11902387 U JP 11902387U JP S6424897 U JPS6424897 U JP S6424897U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- covering
- resin mold
- electric element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987119023U JPS6424897U (zh) | 1987-08-03 | 1987-08-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987119023U JPS6424897U (zh) | 1987-08-03 | 1987-08-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6424897U true JPS6424897U (zh) | 1989-02-10 |
Family
ID=31363890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987119023U Pending JPS6424897U (zh) | 1987-08-03 | 1987-08-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6424897U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7311877B2 (en) * | 2003-07-31 | 2007-12-25 | General Electric Company | Inhibition of corrosion in fluid systems |
-
1987
- 1987-08-03 JP JP1987119023U patent/JPS6424897U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7311877B2 (en) * | 2003-07-31 | 2007-12-25 | General Electric Company | Inhibition of corrosion in fluid systems |