JPS6424850U - - Google Patents
Info
- Publication number
- JPS6424850U JPS6424850U JP12108887U JP12108887U JPS6424850U JP S6424850 U JPS6424850 U JP S6424850U JP 12108887 U JP12108887 U JP 12108887U JP 12108887 U JP12108887 U JP 12108887U JP S6424850 U JPS6424850 U JP S6424850U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- hole
- locking hole
- circuit board
- screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000002265 prevention Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12108887U JPS6424850U (sh) | 1987-08-06 | 1987-08-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12108887U JPS6424850U (sh) | 1987-08-06 | 1987-08-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6424850U true JPS6424850U (sh) | 1989-02-10 |
Family
ID=31367777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12108887U Pending JPS6424850U (sh) | 1987-08-06 | 1987-08-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6424850U (sh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005013658A1 (ja) * | 2003-08-05 | 2005-02-10 | Kabushiki Kaisha Yaskawa Denki | パワー素子冷却装置 |
-
1987
- 1987-08-06 JP JP12108887U patent/JPS6424850U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005013658A1 (ja) * | 2003-08-05 | 2005-02-10 | Kabushiki Kaisha Yaskawa Denki | パワー素子冷却装置 |
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