JPS6423924U - - Google Patents
Info
- Publication number
- JPS6423924U JPS6423924U JP11747387U JP11747387U JPS6423924U JP S6423924 U JPS6423924 U JP S6423924U JP 11747387 U JP11747387 U JP 11747387U JP 11747387 U JP11747387 U JP 11747387U JP S6423924 U JPS6423924 U JP S6423924U
- Authority
- JP
- Japan
- Prior art keywords
- container
- heat
- switching element
- semiconductor switching
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Cookers (AREA)
Description
第１図は本考案の一実施例を示す一部切欠き正
面図、第２図は温度制御装置のブロツク図、第３
図は温度特性図、第４図は他の実施例を示す要部
の一部切欠き正面図である。
１…ケース、２…収容体、３…ヒータ、４…温
度制御装置、１４…トライアツク（半導体スイツ
チング素子）、１７…放熱部。
Fig. 1 is a partially cutaway front view showing an embodiment of the present invention, Fig. 2 is a block diagram of the temperature control device, and Fig. 3 is a partially cutaway front view showing an embodiment of the present invention.
The figure is a temperature characteristic diagram, and FIG. 4 is a partially cutaway front view of the main part showing another embodiment. DESCRIPTION OF SYMBOLS 1... Case, 2... Container, 3... Heater, 4... Temperature control device, 14... Triax (semiconductor switching element), 17... Heat dissipation part.
Claims (1)
設けられるケースと、前記収容体に設けられ液体
を加熱沸騰するヒータと、このヒータの通電率を
可変させるトライアツク等の半導体スイツチング
素子を有する温度制御装置と、前記ケースに設け
られ前記半導体スイツチング素子の発熱を放散さ
せる放熱部とを具備したことを特徴とする電気保
温ポツト。 A temperature control system comprising: a container for containing a liquid, a case provided to cover the container, a heater provided in the container to heat and boil the liquid, and a semiconductor switching element such as a triax for varying the energization rate of the heater. An electric heat-retaining pot comprising: a control device; and a heat radiating section provided in the case to dissipate heat generated by the semiconductor switching element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11747387U JPS6423924U (en) | 1987-07-29 | 1987-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11747387U JPS6423924U (en) | 1987-07-29 | 1987-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6423924U true JPS6423924U (en) | 1989-02-08 |
Family
ID=31360961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11747387U Pending JPS6423924U (en) | 1987-07-29 | 1987-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6423924U (en) |
-
1987
- 1987-07-29 JP JP11747387U patent/JPS6423924U/ja active Pending
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