JPS6423564U - - Google Patents
Info
- Publication number
- JPS6423564U JPS6423564U JP11864287U JP11864287U JPS6423564U JP S6423564 U JPS6423564 U JP S6423564U JP 11864287 U JP11864287 U JP 11864287U JP 11864287 U JP11864287 U JP 11864287U JP S6423564 U JPS6423564 U JP S6423564U
- Authority
- JP
- Japan
- Prior art keywords
- lock
- wire
- locked
- lock body
- locked object
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Flexible Shafts (AREA)
- Lock And Its Accessories (AREA)
Description
第１図は本考案の第１の実施例の一部断面を含
む正面図、第２図は第１図における−線断面
図、第３図は第２の実施例の破断正面図、第４図
は第３図における−線断面矢視図である。
Ｐ……自転車のシートポスト、１，３０……ワ
イヤ錠、２……錠本体、３……錠杆挿入錠、５…
…錠杆、６……コイルワイヤ、４，９……錠本体
、本体ケースの取付金具、１０……符号錠、１１
……ワイヤの巻取装置、１２……ワイヤ。
FIG. 1 is a partially sectional front view of the first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line -- in FIG. The figure is a sectional view taken along the line - in FIG. 3. P... Bicycle seat post, 1, 30... Wire lock, 2... Lock body, 3... Lock rod insertion lock, 5...
...Lock rod, 6...Coil wire, 4, 9...Lock body, main body case mounting bracket, 10...Signed lock, 11
... Wire winding device, 12 ... Wire.
Claims (1)
、該錠本体に一端が固定され他端に上記錠杆を取
着したワイヤとからなり、該ワイヤを被施錠物内
に通して上記錠前を施錠するワイヤ錠において、 前記錠本体を前記被施錠物の所定位置に固定す
る本体取付部材と、 前記ワイヤを引き出し可能に前記錠本体に収納
するワイヤ収納手段と を備えることを特徴とするワイヤ錠。[Scope of Claim for Utility Model Registration] A lock consisting of a lock body provided with a lock into which a lock rod is inserted and locked, and a wire having one end fixed to the lock body and the lock rod attached to the other end; A wire lock that is passed through a locked object to lock the lock, comprising: a main body attachment member that fixes the lock body to a predetermined position of the locked object; and a wire storage means that stores the wire in the lock body so that the wire can be drawn out. A wire lock characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987118642U JPH0533645Y2 (en) | 1987-07-31 | 1987-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987118642U JPH0533645Y2 (en) | 1987-07-31 | 1987-07-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6423564U true JPS6423564U (en) | 1989-02-08 |
| JPH0533645Y2 JPH0533645Y2 (en) | 1993-08-26 |
Family
ID=31363165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987118642U Expired - Lifetime JPH0533645Y2 (en) | 1987-07-31 | 1987-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0533645Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7843068B2 (en) | 2005-06-30 | 2010-11-30 | Shinko Electric Industries Co., Ltd. | Semiconductor chip and method of manufacturing the same |
| US7875552B2 (en) | 2008-06-10 | 2011-01-25 | Samsung Electronics Co., Ltd. | Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed thereby |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55166873U (en) * | 1979-05-21 | 1980-12-01 |
-
1987
- 1987-07-31 JP JP1987118642U patent/JPH0533645Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55166873U (en) * | 1979-05-21 | 1980-12-01 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7843068B2 (en) | 2005-06-30 | 2010-11-30 | Shinko Electric Industries Co., Ltd. | Semiconductor chip and method of manufacturing the same |
| US7875552B2 (en) | 2008-06-10 | 2011-01-25 | Samsung Electronics Co., Ltd. | Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed thereby |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0533645Y2 (en) | 1993-08-26 |