JPS6422046U - - Google Patents
Info
- Publication number
- JPS6422046U JPS6422046U JP11690187U JP11690187U JPS6422046U JP S6422046 U JPS6422046 U JP S6422046U JP 11690187 U JP11690187 U JP 11690187U JP 11690187 U JP11690187 U JP 11690187U JP S6422046 U JPS6422046 U JP S6422046U
- Authority
- JP
- Japan
- Prior art keywords
- plastic package
- external connection
- electrode pin
- exposed
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11690187U JPS6422046U (et) | 1987-07-29 | 1987-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11690187U JPS6422046U (et) | 1987-07-29 | 1987-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6422046U true JPS6422046U (et) | 1989-02-03 |
Family
ID=31359862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11690187U Pending JPS6422046U (et) | 1987-07-29 | 1987-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6422046U (et) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5512781A (en) * | 1992-12-01 | 1996-04-30 | Kabushiki Kaisha Toshiba | Semiconductor package device for super high-frequency band |
| KR100342812B1 (ko) * | 1996-11-28 | 2002-11-18 | 앰코 테크놀로지 코리아 주식회사 | 접지선및전원선을구비한에어리어어레이범프드반도체패키지 |
| KR100342811B1 (ko) * | 1996-11-28 | 2002-11-27 | 앰코 테크놀로지 코리아 주식회사 | 복수개의칩이내장된에어리어어레이범프드반도체패키지 |
| KR100379083B1 (ko) * | 1996-11-28 | 2004-02-05 | 앰코 테크놀로지 코리아 주식회사 | 리드온칩에어리어어레이범프드반도체패키지 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6131626A (ja) * | 1984-07-24 | 1986-02-14 | Mitsubishi Heavy Ind Ltd | 燃焼器の燃料ノズルパ−ジ装置 |
-
1987
- 1987-07-29 JP JP11690187U patent/JPS6422046U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6131626A (ja) * | 1984-07-24 | 1986-02-14 | Mitsubishi Heavy Ind Ltd | 燃焼器の燃料ノズルパ−ジ装置 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5512781A (en) * | 1992-12-01 | 1996-04-30 | Kabushiki Kaisha Toshiba | Semiconductor package device for super high-frequency band |
| KR100342812B1 (ko) * | 1996-11-28 | 2002-11-18 | 앰코 테크놀로지 코리아 주식회사 | 접지선및전원선을구비한에어리어어레이범프드반도체패키지 |
| KR100342811B1 (ko) * | 1996-11-28 | 2002-11-27 | 앰코 테크놀로지 코리아 주식회사 | 복수개의칩이내장된에어리어어레이범프드반도체패키지 |
| KR100379083B1 (ko) * | 1996-11-28 | 2004-02-05 | 앰코 테크놀로지 코리아 주식회사 | 리드온칩에어리어어레이범프드반도체패키지 |