JPS6422033U - - Google Patents
Info
- Publication number
- JPS6422033U JPS6422033U JP11771087U JP11771087U JPS6422033U JP S6422033 U JPS6422033 U JP S6422033U JP 11771087 U JP11771087 U JP 11771087U JP 11771087 U JP11771087 U JP 11771087U JP S6422033 U JPS6422033 U JP S6422033U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- plate
- fixed
- plates
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987117710U JP2528842Y2 (ja) | 1987-07-30 | 1987-07-30 | 半導体素子の樹脂封止装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987117710U JP2528842Y2 (ja) | 1987-07-30 | 1987-07-30 | 半導体素子の樹脂封止装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6422033U true JPS6422033U (US07714131-20100511-C00038.png) | 1989-02-03 |
| JP2528842Y2 JP2528842Y2 (ja) | 1997-03-12 |
Family
ID=31361405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987117710U Expired - Lifetime JP2528842Y2 (ja) | 1987-07-30 | 1987-07-30 | 半導体素子の樹脂封止装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2528842Y2 (US07714131-20100511-C00038.png) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6125121U (ja) * | 1984-07-19 | 1986-02-14 | 株式会社東芝 | モ−ルド成形装置 |
| JPS6256111U (US07714131-20100511-C00038.png) * | 1985-09-27 | 1987-04-07 | ||
| JPS6279632A (ja) * | 1985-10-03 | 1987-04-13 | Mitsubishi Electric Corp | 樹脂封止装置 |
-
1987
- 1987-07-30 JP JP1987117710U patent/JP2528842Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6125121U (ja) * | 1984-07-19 | 1986-02-14 | 株式会社東芝 | モ−ルド成形装置 |
| JPS6256111U (US07714131-20100511-C00038.png) * | 1985-09-27 | 1987-04-07 | ||
| JPS6279632A (ja) * | 1985-10-03 | 1987-04-13 | Mitsubishi Electric Corp | 樹脂封止装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2528842Y2 (ja) | 1997-03-12 |
