JPS6419295U - - Google Patents

Info

Publication number
JPS6419295U
JPS6419295U JP11360287U JP11360287U JPS6419295U JP S6419295 U JPS6419295 U JP S6419295U JP 11360287 U JP11360287 U JP 11360287U JP 11360287 U JP11360287 U JP 11360287U JP S6419295 U JPS6419295 U JP S6419295U
Authority
JP
Japan
Prior art keywords
lead wire
voltage rectifier
high voltage
molded case
microwave oven
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11360287U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11360287U priority Critical patent/JPS6419295U/ja
Publication of JPS6419295U publication Critical patent/JPS6419295U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Constitution Of High-Frequency Heating (AREA)
JP11360287U 1987-07-24 1987-07-24 Pending JPS6419295U (fi)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11360287U JPS6419295U (fi) 1987-07-24 1987-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11360287U JPS6419295U (fi) 1987-07-24 1987-07-24

Publications (1)

Publication Number Publication Date
JPS6419295U true JPS6419295U (fi) 1989-01-31

Family

ID=31353586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11360287U Pending JPS6419295U (fi) 1987-07-24 1987-07-24

Country Status (1)

Country Link
JP (1) JPS6419295U (fi)

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