JPS6418779U - - Google Patents

Info

Publication number
JPS6418779U
JPS6418779U JP11437087U JP11437087U JPS6418779U JP S6418779 U JPS6418779 U JP S6418779U JP 11437087 U JP11437087 U JP 11437087U JP 11437087 U JP11437087 U JP 11437087U JP S6418779 U JPS6418779 U JP S6418779U
Authority
JP
Japan
Prior art keywords
circuit pattern
integrally formed
board
substrate part
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11437087U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11437087U priority Critical patent/JPS6418779U/ja
Publication of JPS6418779U publication Critical patent/JPS6418779U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
JP11437087U 1987-07-24 1987-07-24 Pending JPS6418779U (US06373033-20020416-M00071.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11437087U JPS6418779U (US06373033-20020416-M00071.png) 1987-07-24 1987-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11437087U JPS6418779U (US06373033-20020416-M00071.png) 1987-07-24 1987-07-24

Publications (1)

Publication Number Publication Date
JPS6418779U true JPS6418779U (US06373033-20020416-M00071.png) 1989-01-30

Family

ID=31355052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11437087U Pending JPS6418779U (US06373033-20020416-M00071.png) 1987-07-24 1987-07-24

Country Status (1)

Country Link
JP (1) JPS6418779U (US06373033-20020416-M00071.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01228190A (ja) * 1988-03-08 1989-09-12 Hokuriku Denki Kogyo Kk 回路基板
JPH07288369A (ja) * 1994-12-05 1995-10-31 Hokuriku Electric Ind Co Ltd 回路基板とその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52126756A (en) * 1976-04-16 1977-10-24 Matsushita Electric Ind Co Ltd Inserttmolding method of preparing electroconductive plate for mounting electronic parts
JPS6232686A (ja) * 1985-08-06 1987-02-12 キヤノン株式会社 導電体層付成形品の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52126756A (en) * 1976-04-16 1977-10-24 Matsushita Electric Ind Co Ltd Inserttmolding method of preparing electroconductive plate for mounting electronic parts
JPS6232686A (ja) * 1985-08-06 1987-02-12 キヤノン株式会社 導電体層付成形品の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01228190A (ja) * 1988-03-08 1989-09-12 Hokuriku Denki Kogyo Kk 回路基板
JPH07288369A (ja) * 1994-12-05 1995-10-31 Hokuriku Electric Ind Co Ltd 回路基板とその製造方法

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