JPS6418779U - - Google Patents
Info
- Publication number
- JPS6418779U JPS6418779U JP11437087U JP11437087U JPS6418779U JP S6418779 U JPS6418779 U JP S6418779U JP 11437087 U JP11437087 U JP 11437087U JP 11437087 U JP11437087 U JP 11437087U JP S6418779 U JPS6418779 U JP S6418779U
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- integrally formed
- board
- substrate part
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001746 injection moulding Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11437087U JPS6418779U (US06373033-20020416-M00071.png) | 1987-07-24 | 1987-07-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11437087U JPS6418779U (US06373033-20020416-M00071.png) | 1987-07-24 | 1987-07-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6418779U true JPS6418779U (US06373033-20020416-M00071.png) | 1989-01-30 |
Family
ID=31355052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11437087U Pending JPS6418779U (US06373033-20020416-M00071.png) | 1987-07-24 | 1987-07-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6418779U (US06373033-20020416-M00071.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01228190A (ja) * | 1988-03-08 | 1989-09-12 | Hokuriku Denki Kogyo Kk | 回路基板 |
JPH07288369A (ja) * | 1994-12-05 | 1995-10-31 | Hokuriku Electric Ind Co Ltd | 回路基板とその製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52126756A (en) * | 1976-04-16 | 1977-10-24 | Matsushita Electric Ind Co Ltd | Inserttmolding method of preparing electroconductive plate for mounting electronic parts |
JPS6232686A (ja) * | 1985-08-06 | 1987-02-12 | キヤノン株式会社 | 導電体層付成形品の製造方法 |
-
1987
- 1987-07-24 JP JP11437087U patent/JPS6418779U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52126756A (en) * | 1976-04-16 | 1977-10-24 | Matsushita Electric Ind Co Ltd | Inserttmolding method of preparing electroconductive plate for mounting electronic parts |
JPS6232686A (ja) * | 1985-08-06 | 1987-02-12 | キヤノン株式会社 | 導電体層付成形品の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01228190A (ja) * | 1988-03-08 | 1989-09-12 | Hokuriku Denki Kogyo Kk | 回路基板 |
JPH07288369A (ja) * | 1994-12-05 | 1995-10-31 | Hokuriku Electric Ind Co Ltd | 回路基板とその製造方法 |