JPS6418708U - - Google Patents

Info

Publication number
JPS6418708U
JPS6418708U JP11417187U JP11417187U JPS6418708U JP S6418708 U JPS6418708 U JP S6418708U JP 11417187 U JP11417187 U JP 11417187U JP 11417187 U JP11417187 U JP 11417187U JP S6418708 U JPS6418708 U JP S6418708U
Authority
JP
Japan
Prior art keywords
circuit board
coil
board surface
parallel
wound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11417187U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11417187U priority Critical patent/JPS6418708U/ja
Publication of JPS6418708U publication Critical patent/JPS6418708U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を説明するための断
面図、第2図は従来のコイルを示す正面図、第3
図は従来のコイルの問題点を説明するための断面
図、第4図は第1図実施例に用いられるコイルの
正面図、第5図は第1図実施例を用いて構成した
LC直列共振回路の回路図、第6図は第5図の回
路のインピーダンス−周波数特性を示す図、第7
図は第1図実施例および従来のコイルを用いて第
5図の回路を構成した場合の特性を示す図である
。 図において、11は基板、12はコイル、13
は本体、14は巻線を示す。
Fig. 1 is a sectional view for explaining one embodiment of the present invention, Fig. 2 is a front view showing a conventional coil, and Fig. 3 is a sectional view for explaining an embodiment of the present invention.
The figure is a cross-sectional view for explaining the problems of the conventional coil, Figure 4 is a front view of the coil used in the embodiment in Figure 1, and Figure 5 is an LC series resonance configured using the embodiment in Figure 1. The circuit diagram of the circuit, Fig. 6 is a diagram showing the impedance-frequency characteristics of the circuit of Fig. 5, and Fig. 7 is a diagram showing the impedance-frequency characteristics of the circuit of Fig. 5.
The figure shows the characteristics when the circuit of FIG. 5 is constructed using the embodiment of FIG. 1 and the conventional coil. In the figure, 11 is a substrate, 12 is a coil, and 13 is a
14 indicates the main body, and 14 indicates the winding.

Claims (1)

【実用新案登録請求の範囲】 基板と、 該基板上に実装されており、かつ磁束の大部分
が基板面と平行となるように巻線が基板面と平行
な方向に進むように巻回されているコイルとを備
えるコイルの実装構造。
[Claims for Utility Model Registration] A circuit board, which is mounted on the circuit board, and is wound in such a way that the winding runs in a direction parallel to the circuit board surface so that most of the magnetic flux is parallel to the circuit board surface. A coil mounting structure comprising a coil and a coil.
JP11417187U 1987-07-25 1987-07-25 Pending JPS6418708U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11417187U JPS6418708U (en) 1987-07-25 1987-07-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11417187U JPS6418708U (en) 1987-07-25 1987-07-25

Publications (1)

Publication Number Publication Date
JPS6418708U true JPS6418708U (en) 1989-01-30

Family

ID=31354674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11417187U Pending JPS6418708U (en) 1987-07-25 1987-07-25

Country Status (1)

Country Link
JP (1) JPS6418708U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7500499B2 (en) * 2003-08-22 2009-03-10 The Yokohama Rubber Co., Ltd. Tire wheel assembly and noise-reducing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7500499B2 (en) * 2003-08-22 2009-03-10 The Yokohama Rubber Co., Ltd. Tire wheel assembly and noise-reducing device

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