JPS6417903U - - Google Patents
Info
- Publication number
- JPS6417903U JPS6417903U JP11308087U JP11308087U JPS6417903U JP S6417903 U JPS6417903 U JP S6417903U JP 11308087 U JP11308087 U JP 11308087U JP 11308087 U JP11308087 U JP 11308087U JP S6417903 U JPS6417903 U JP S6417903U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- adhesive
- curable resin
- semiconductor device
- ultraviolet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 1
Landscapes
- Package Closures (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11308087U JPS6417903U (zh) | 1987-07-23 | 1987-07-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11308087U JPS6417903U (zh) | 1987-07-23 | 1987-07-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6417903U true JPS6417903U (zh) | 1989-01-30 |
Family
ID=31352603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11308087U Pending JPS6417903U (zh) | 1987-07-23 | 1987-07-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6417903U (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05147608A (ja) * | 1991-11-21 | 1993-06-15 | Disco Abrasive Syst Ltd | 樹脂封止装置 |
| KR100606513B1 (ko) * | 1998-10-27 | 2006-07-31 | 마츠시타 덴끼 산교 가부시키가이샤 | 부품 부착 방법 및 부품 부착 장치 |
-
1987
- 1987-07-23 JP JP11308087U patent/JPS6417903U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05147608A (ja) * | 1991-11-21 | 1993-06-15 | Disco Abrasive Syst Ltd | 樹脂封止装置 |
| KR100606513B1 (ko) * | 1998-10-27 | 2006-07-31 | 마츠시타 덴끼 산교 가부시키가이샤 | 부품 부착 방법 및 부품 부착 장치 |