JPS6416260U - - Google Patents
Info
- Publication number
- JPS6416260U JPS6416260U JP1987111118U JP11111887U JPS6416260U JP S6416260 U JPS6416260 U JP S6416260U JP 1987111118 U JP1987111118 U JP 1987111118U JP 11111887 U JP11111887 U JP 11111887U JP S6416260 U JPS6416260 U JP S6416260U
- Authority
- JP
- Japan
- Prior art keywords
- pressing
- plate
- turntable
- outer periphery
- pressing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007246 mechanism Effects 0.000 claims description 5
- 238000005498 polishing Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims 1
Description
第1図は実施例のポリツシングマシンのプレー
ト押圧機構を示した正面断面図である。
20……トツプリング、26……プレート、3
6……ピストン、44……加圧板、48……ウエ
ハー、50……ウエイト、56……ターンテーブ
ル、58……クロス、60……空間部。
FIG. 1 is a front sectional view showing a plate pressing mechanism of a polishing machine according to an embodiment. 20... Top spring, 26... Plate, 3
6... Piston, 44... Pressure plate, 48... Wafer, 50... Weight, 56... Turntable, 58... Cross, 60... Space section.
Claims (1)
ためのプレートを加工するポリツシングマシンの
プレート押圧機構において、 前記プレートの外周縁近傍を前記ターンテーブ
ル方向へ押圧するための外周押圧装置と、 前記プレートの中央近傍を前記ターンテーブル
方向へ押圧するための中央押圧装置とを具備し、 前記プレートにかかる押圧力のバランスを調整
すべく、前記外周押圧装置と中央押圧装置の少な
くとも一方はその圧力を微調整可能であることを
特徴とするポリツシングマシンのプレート押圧機
構。[Claims for Utility Model Registration] In a plate pressing mechanism of a polishing machine that processes a plate for pressing a wafer against a polishing surface of a turntable, the plate pressing mechanism for pressing the vicinity of the outer periphery of the plate toward the turntable is provided. an outer periphery pressing device; and a central pressing device for pressing the vicinity of the center of the plate toward the turntable, and in order to adjust the balance of the pressing force applied to the plate, the outer periphery pressing device and the central pressing device A plate pressing mechanism of a polishing machine, wherein at least one of the plate pressing mechanisms is capable of finely adjusting its pressure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987111118U JPH0440848Y2 (en) | 1987-07-20 | 1987-07-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987111118U JPH0440848Y2 (en) | 1987-07-20 | 1987-07-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6416260U true JPS6416260U (en) | 1989-01-26 |
JPH0440848Y2 JPH0440848Y2 (en) | 1992-09-25 |
Family
ID=31348886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987111118U Expired JPH0440848Y2 (en) | 1987-07-20 | 1987-07-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0440848Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01135464A (en) * | 1987-11-16 | 1989-05-29 | Mitsubishi Metal Corp | Polishing device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57194874A (en) * | 1981-05-27 | 1982-11-30 | Hitachi Ltd | Lapping device |
JPS63150156A (en) * | 1986-12-16 | 1988-06-22 | Naoetsu Denshi Kogyo Kk | Wafer polishing device |
-
1987
- 1987-07-20 JP JP1987111118U patent/JPH0440848Y2/ja not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57194874A (en) * | 1981-05-27 | 1982-11-30 | Hitachi Ltd | Lapping device |
JPS63150156A (en) * | 1986-12-16 | 1988-06-22 | Naoetsu Denshi Kogyo Kk | Wafer polishing device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01135464A (en) * | 1987-11-16 | 1989-05-29 | Mitsubishi Metal Corp | Polishing device |
Also Published As
Publication number | Publication date |
---|---|
JPH0440848Y2 (en) | 1992-09-25 |