JPS6414287A - Reactive hot melt adhesive - Google Patents

Reactive hot melt adhesive

Info

Publication number
JPS6414287A
JPS6414287A JP16886687A JP16886687A JPS6414287A JP S6414287 A JPS6414287 A JP S6414287A JP 16886687 A JP16886687 A JP 16886687A JP 16886687 A JP16886687 A JP 16886687A JP S6414287 A JPS6414287 A JP S6414287A
Authority
JP
Japan
Prior art keywords
component
hot melt
skeleton
melt adhesive
reactive hot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16886687A
Other languages
Japanese (ja)
Inventor
Masahiko Takahashi
Akiyoshi Yanagisawa
Nobuo Yamanishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink and Chemicals Co Ltd filed Critical Dainippon Ink and Chemicals Co Ltd
Priority to JP16886687A priority Critical patent/JPS6414287A/en
Publication of JPS6414287A publication Critical patent/JPS6414287A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/69—Polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:To provide the title adhesive which has excellent adhesion rate, heat resistance and adhesion strength and is also excellent in adhesion to a plastic film, and which comprises a particular crystalline urethane prepolymer. CONSTITUTION:A crystalline urethane prepolymer having a structure in which a polyester skeleton is bonded to a polyurethane skeleton by a urethane bond and having an isocyanate group left at a molecular terminal thereof is obtd. by performing addn. reaction of a polyisocyanate (A) (e.g., 2,4-tolylene diisocyanate), a polyester polyol (B) having an average MW of 1000-30,000 and a polyol having a butadiene skeleton (C) whose average MW is 500-10,000 in a ratio of the isocyanate groups of component (A) to the hydroxyl groups of components (B) and (C) of 1.05-3/1 and in a component (B) to/component (C) equivalent ratio of 95/5-60/40. To the prepolymer are added a plasticizer, a tackifier, a filter, etc., thereby obtaining a reactive hot melt adhesive.
JP16886687A 1987-07-08 1987-07-08 Reactive hot melt adhesive Pending JPS6414287A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16886687A JPS6414287A (en) 1987-07-08 1987-07-08 Reactive hot melt adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16886687A JPS6414287A (en) 1987-07-08 1987-07-08 Reactive hot melt adhesive

Publications (1)

Publication Number Publication Date
JPS6414287A true JPS6414287A (en) 1989-01-18

Family

ID=15876016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16886687A Pending JPS6414287A (en) 1987-07-08 1987-07-08 Reactive hot melt adhesive

Country Status (1)

Country Link
JP (1) JPS6414287A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02258243A (en) * 1989-03-31 1990-10-19 Hitachi Kasei Polymer Kk Manufacture of panel of honeycomb sandwich structure
JPH04300985A (en) * 1991-03-29 1992-10-23 Sunstar Eng Inc Reactive hot-melt composition
JPH04328187A (en) * 1991-04-30 1992-11-17 Dainippon Ink & Chem Inc Aqueous adhesive and method of bonding
JPH0517736A (en) * 1991-07-17 1993-01-26 Mitsui Toatsu Chem Inc Reactive hot melt adhesive composition
JPH0551573A (en) * 1991-08-22 1993-03-02 Dainippon Ink & Chem Inc Hot-melt adhesive
JP2002180032A (en) * 2000-12-18 2002-06-26 Nhk Spring Co Ltd Method for sealing electronic component
WO2013084415A1 (en) * 2011-12-07 2013-06-13 株式会社 東芝 Refrigerator

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02258243A (en) * 1989-03-31 1990-10-19 Hitachi Kasei Polymer Kk Manufacture of panel of honeycomb sandwich structure
JPH04300985A (en) * 1991-03-29 1992-10-23 Sunstar Eng Inc Reactive hot-melt composition
JPH04328187A (en) * 1991-04-30 1992-11-17 Dainippon Ink & Chem Inc Aqueous adhesive and method of bonding
JPH0517736A (en) * 1991-07-17 1993-01-26 Mitsui Toatsu Chem Inc Reactive hot melt adhesive composition
JPH0551573A (en) * 1991-08-22 1993-03-02 Dainippon Ink & Chem Inc Hot-melt adhesive
JP2002180032A (en) * 2000-12-18 2002-06-26 Nhk Spring Co Ltd Method for sealing electronic component
WO2013084415A1 (en) * 2011-12-07 2013-06-13 株式会社 東芝 Refrigerator
CN104081141A (en) * 2011-12-07 2014-10-01 株式会社东芝 Refrigerator
JPWO2013084415A1 (en) * 2011-12-07 2015-04-27 株式会社東芝 refrigerator
EP2789950A4 (en) * 2011-12-07 2015-09-09 Toshiba Kk Refrigerator
CN104081141B (en) * 2011-12-07 2016-05-04 株式会社东芝 Refrigerator

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