JPS6413796U - - Google Patents
Info
- Publication number
- JPS6413796U JPS6413796U JP1987108644U JP10864487U JPS6413796U JP S6413796 U JPS6413796 U JP S6413796U JP 1987108644 U JP1987108644 U JP 1987108644U JP 10864487 U JP10864487 U JP 10864487U JP S6413796 U JPS6413796 U JP S6413796U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- sealing resin
- shield
- circuit board
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 238000000034 method Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987108644U JPS6413796U (US07413550-20080819-C00001.png) | 1987-07-15 | 1987-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987108644U JPS6413796U (US07413550-20080819-C00001.png) | 1987-07-15 | 1987-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413796U true JPS6413796U (US07413550-20080819-C00001.png) | 1989-01-24 |
Family
ID=31344171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987108644U Pending JPS6413796U (US07413550-20080819-C00001.png) | 1987-07-15 | 1987-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413796U (US07413550-20080819-C00001.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017199752A (ja) * | 2016-04-26 | 2017-11-02 | ローム株式会社 | パワーモジュールおよびその製造方法 |
-
1987
- 1987-07-15 JP JP1987108644U patent/JPS6413796U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017199752A (ja) * | 2016-04-26 | 2017-11-02 | ローム株式会社 | パワーモジュールおよびその製造方法 |
