JPS6413776U - - Google Patents

Info

Publication number

JPS6413776U

JPS6413776U JP10982987U JP10982987U JPS6413776U JP S6413776 U JPS6413776 U JP S6413776U JP 10982987 U JP10982987 U JP 10982987U JP 10982987 U JP10982987 U JP 10982987U JP S6413776 U JPS6413776 U JP S6413776U

Authority

JP

Japan

Prior art keywords

package

circuit board

printed circuit

electronic component

electronic

Prior art date

1987-07-17

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000853 adhesive Substances 0.000 claims description 3
• 230000001070 adhesive effect Effects 0.000 claims description 3
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1