JPS6413126U - - Google Patents
Info
- Publication number
- JPS6413126U JPS6413126U JP10867087U JP10867087U JPS6413126U JP S6413126 U JPS6413126 U JP S6413126U JP 10867087 U JP10867087 U JP 10867087U JP 10867087 U JP10867087 U JP 10867087U JP S6413126 U JPS6413126 U JP S6413126U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- bonding pad
- recognize
- mark
- allowing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10867087U JPS6413126U (me) | 1987-07-14 | 1987-07-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10867087U JPS6413126U (me) | 1987-07-14 | 1987-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413126U true JPS6413126U (me) | 1989-01-24 |
Family
ID=31344223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10867087U Pending JPS6413126U (me) | 1987-07-14 | 1987-07-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413126U (me) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0689676A (ja) * | 1992-01-08 | 1994-03-29 | Nec Corp | 駆動用半導体素子内蔵型蛍光表示パネル |
-
1987
- 1987-07-14 JP JP10867087U patent/JPS6413126U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0689676A (ja) * | 1992-01-08 | 1994-03-29 | Nec Corp | 駆動用半導体素子内蔵型蛍光表示パネル |