JPS6412555U - - Google Patents
Info
- Publication number
- JPS6412555U JPS6412555U JP10534787U JP10534787U JPS6412555U JP S6412555 U JPS6412555 U JP S6412555U JP 10534787 U JP10534787 U JP 10534787U JP 10534787 U JP10534787 U JP 10534787U JP S6412555 U JPS6412555 U JP S6412555U
- Authority
- JP
- Japan
- Prior art keywords
- damper
- arm
- activation
- actuator
- rotating shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011084 recovery Methods 0.000 claims description 3
- 230000004913 activation Effects 0.000 claims 6
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 1
Landscapes
- Air-Flow Control Members (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10534787U JPS6412555U (de) | 1987-07-10 | 1987-07-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10534787U JPS6412555U (de) | 1987-07-10 | 1987-07-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6412555U true JPS6412555U (de) | 1989-01-23 |
Family
ID=31337880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10534787U Pending JPS6412555U (de) | 1987-07-10 | 1987-07-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6412555U (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02308976A (ja) * | 1989-05-24 | 1990-12-21 | Toki Corp Kk | アクチュエータ |
US7387229B2 (en) | 1998-06-19 | 2008-06-17 | Matsushita Electric Industrial Co., Ltd. | Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore |
-
1987
- 1987-07-10 JP JP10534787U patent/JPS6412555U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02308976A (ja) * | 1989-05-24 | 1990-12-21 | Toki Corp Kk | アクチュエータ |
US7387229B2 (en) | 1998-06-19 | 2008-06-17 | Matsushita Electric Industrial Co., Ltd. | Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore |