JPS641203Y2 - - Google Patents

Description

[Detailed description of the invention] <Industrial field of application> As shown in FIG. Attach the tape 4 and the lower tape 5, and insert the chip part 1 into each hole 2.
This invention relates to an improvement in a taping packaging device for storing and packaging.

<Prior art> The above-mentioned packaging device first attaches the lower tape 5 to the inner tape 3, then loads the chip part 1 into the storage hole 2 of the inner tape 3, and then attaches the upper tape 4 to the upper surface of the inner tape 3. However, if the means for performing each process of such taping packaging are arranged linearly, a large space is required in terms of plane.

In addition, when attaching the lower tape 5 and upper tape 4 to the inner tape 3, simply pressing both tapes will cause the lower tape 5 and upper tape 4 to have wrinkles and fine irregularities, leaving the inner tape 3
As a result, the bonding force between the tapes may be insufficient, or the sealing quality of both the upper and lower tapes 3 and 4 may be insufficient, and as a result, the upper tape 4 and the lower tape 5 may Inconveniences arise in that the chip parts 1 may be peeled off or the stored chip parts 1 may be affected by the external atmosphere.

In order to deal with such problems, conventionally, the third
A packaging device as shown in the figure has been proposed.

This packaging device passes an inner tape 3 and a lower tape 5 between a heater stand 6 and a pressure roller 7 to adhere them, and then passes both tapes 3 and 5 between a work clamper 9 and a roll heater 10. The chip parts 1 are guided to be wound on the taping drum 8 installed oppositely, and on the winding path on the taping drum 8, the chip parts 1 are first loaded into each storage hole 2 by the work clamper 9, and at the end of the winding path, the chip parts 1 are placed in the roll heater 10. The upper tape 4 that has been wound and guided is attached to the upper surface of the inner tape 3.

According to this device, while the inner tape 3 and the lower tape 5 pass through the outer circumferential surface of the taping drum 8, loading of the chip parts 1 and pasting of the upper tape 4 are performed, so the taping and packaging processing line is shortened. In addition, since the lower tape 5 and the upper tape 4 are heated and pressed against the inner tape 3, they are adhered in a smooth state without wrinkles or small irregularities, which strengthens the bonding force between the tapes and allows the chips to The degree of sealing of parts is improved.

<Problems to be solved by the invention> However, in the packaging device having the above structure, another problem arises, and the lower tape 5 is completely wrinkled by the heater stand 6.
However, on the taping drum 8, it is on the inner circumferential side of the winding path, so on the winding path, the lower tape 5 is different from the inner tape 3 due to the difference in the radius of curvature between the inner tape 3 and the lower tape 5. It will be compressed.

Therefore, as shown in FIG. 4, a part of the lower tape 5 protrudes into the storage hole 2 and the chip part 1
Between loading the chip inside and pasting the upper tape 4, the protruding portion 11 of the lower tape 5 may cause the chip part 1 to stand up or be thrown out of the hole 2, resulting in poor packaging. Occasionally this occurred.

Furthermore, when the upper tape 4 is attached, the chip part 1 that has climbed onto the protruding portion 11 of the lower tape 5 is adhered to the upper tape 4, as shown in FIG. When peeling off the inner tape 3 to open the hole 2, the chip part 1 was sometimes taken out together with the peeled off upper tape 4.

The object of the present invention is to reduce the planar space of the entire processing line and to ensure that chip parts can be loaded and packed.

<Means for Solving the Problems> In order to achieve the above object, the present invention applies a lower tape to an inner tape having a chip storage hole, and then supplies chip parts to the storage hole of the inner tape. In a taping and packing apparatus for chip parts, which is configured to load the chips and then stick the upper tape on the upper surface of the inner tape to close the upper part of the storage hole, there is provided a heater stand for contacting and guiding the lower tape in the front stage of the inner tape transfer path; A pressure roller is provided to press the inner tape and stick both tapes together, and a taping drum that winds and guides both tapes that are stuck to each other is installed at the rear stage of the heater stand. A parts supply means for supplying chip parts to the storage hole is installed in the winding path, and a roll heater is installed at the end of the tape winding path to attach the upper tape to the upper surface of the inner tape between the taping drum and the tape winding path. The lower tape guide surface of the heater stand is configured to be an arcuate surface having approximately the same radius of curvature as the outer peripheral surface of the taping drum.

<Function> According to the above configuration, loading of chip parts and pasting of the upper tape are performed around the taping drum, and the taping and packaging process line can be shortened. Further, since the lower tape and the upper tape are stretched by heating and adhered to the inner tape in a smooth state without wrinkles or fine irregularities, the bonding force between the tapes becomes strong.

Moreover, since the lower tape is attached to the inner tape in a curved state similar to that on the taping drum 8, it is not compressed against the inner tape on the winding path of the taping drum. No protrusion is observed within the storage hole.

<Example> Hereinafter, the present invention will be described in detail based on an example shown in the drawings.

FIG. 2 shows the device of the present invention. This device is basically the same in structure as the device shown in FIG. After pasting, attach both tapes 3 and 5.
A workpiece clamper 9 and a roll heater 10 are arranged to be wound around a taping drum 8 which is arranged opposite to each other, and in the winding path on this taping drum 8, the chip parts 1 are first loaded into each storage hole 2 by the workpiece clamper 9. At the end of the winding path, the upper tape 4 that has been guided around the roll heater 10 is transferred to the inner tape 3.
It has a structure that is attached to the top surface.

In the present invention, the lower tape guide surface 12 of the heater stand 6 is formed into an arcuate surface having the same radius of curvature R as the outer peripheral surface of the taping drum 8.

According to the above configuration, the lower tape 5 is attached to the heater stand 6
The lower tape 5 is attached to the inner tape 3 in a stretched state with wrinkles and fine irregularities, but the lower tape 5 is attached to the inner tape 3 in a curved state similar to that on the taping drum 8. 8 is not compressed against the inner tape 3 on the winding path 8, and therefore no protrusion is observed within the storage hole 2.

<Effects of the invention> As described above, according to the invention, since the loading of chip parts and the application of the upper tape are performed at the same time in the winding path of the taping drum, the taping and packaging process line can be shortened. In addition to reducing the planar space, the lower and upper tapes are heated and pressed against the inner tape, so these tapes are adhered smoothly without wrinkles or small irregularities, making it easier for the tapes to stick together. This strengthens the bonding force and improves the sealing of chip parts.

Moreover, since the lower tape is attached to the inner tape in the same curved state as on the taping drum, it is not compressed against the inner tape on the winding path of the taping drum.
A protruding portion does not protrude within the storage hole, and therefore, there is no problem with improper loading of chip parts due to the occurrence of a protruding part, or the inconvenience of chip parts adhering to the upper tape.
The packaging will be in good condition.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing a part of a taping-packed product, Fig. 2 is a schematic diagram of the taping packaging device according to the present invention, Fig. 3 is a schematic diagram of a conventionally proposed device, and Fig. 4 is the same. FIG. 5 is an enlarged front view of the chip component loading section, and FIG. 5 is an enlarged sectional view showing a part of the packaged product. 1... Chip parts, 2... Storage hole, 3... Inner tape, 4... Top tape, 5... Bottom tape,
6... Heater stand, 7... Press roller, 8... Taping drum, 9... Work clamper (parts supply means), 10... Roll heater.

Claims (1)

[Claims for Utility Model Registration] Inner tape 3 having chip parts storage holes 2
After pasting the lower tape 5 on the
In the taping and packaging device for chip parts, the chip parts 1 is supplied and loaded into the storage hole 2 of the inner tape 3, and then the upper tape 4 is attached to the upper surface of the inner tape 3 to close the upper part of the storage hole 2. A heater stand 6 for contacting and guiding the lower tape 5 and a pressure roller 7 for pressing the inner tape 3 and pasting both tapes 3 and 5 are provided at the front stage of the path, and at the rear stage of the heater stage 6, there are provided A taping drum 8 is provided for winding and guiding both tapes 3 and 5.
Insert chip part 1 into storage hole 2 on the upper tape winding path.
Further, at the end of the tape winding path, a roll heater 10 for adhering the upper tape 4 to the upper surface of the inner tape 3 between the taping drum 8 and the inner tape 3 is provided. A taping and packaging device for chip parts, characterized in that a lower tape guide surface 12 of a heater stand 6 is formed into an arcuate surface having a radius of curvature R that is approximately the same as the outer peripheral surface of a taping drum 8.