JPS6411996A - Production of cu-sn composite material for electronic parts - Google Patents

Production of cu-sn composite material for electronic parts

Info

Publication number
JPS6411996A
JPS6411996A JP16518987A JP16518987A JPS6411996A JP S6411996 A JPS6411996 A JP S6411996A JP 16518987 A JP16518987 A JP 16518987A JP 16518987 A JP16518987 A JP 16518987A JP S6411996 A JPS6411996 A JP S6411996A
Authority
JP
Japan
Prior art keywords
layer
fuel
air
electronic parts
composite material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16518987A
Other languages
Japanese (ja)
Other versions
JPH0510439B2 (en
Inventor
Ryoichi Nobeyoshi
Hideo Ikeda
Masato Uchiito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP16518987A priority Critical patent/JPS6411996A/en
Publication of JPS6411996A publication Critical patent/JPS6411996A/en
Publication of JPH0510439B2 publication Critical patent/JPH0510439B2/ja
Granted legal-status Critical Current

Links

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE:To produce a Cu-Sn composite material for electronic parts having improved luster, electric resistance and solderability by tinning a Cu material to a specified thickness, introducing the tinned material into a treating furnace, blowing combustion gas on the Sn layer under specified conditions to melt the Sn layer and rapidly cooling the molten layer. CONSTITUTION:A Cu or Cu alloy bar or wire is electroplated with Sn or an Sn alloy to 0.3-10mum thickness and introduced into a treating furnace. Fuel is mixed with air in <=1 air ratio (value obtd. by dividing the amt. of air actually used to burn fuel by the theoretical amt. of air required to burn the fuel) and the fuel is burned. The resulting gas having <=0.1vol.%, preferably 0.90-0.95% oxygen concn. is introduced into the treating furnace and blown on the Sn or Sn alloy layer at >=1m/sec velocity to heat the layer. At this time, the interior of the furnace is kept under >=1atm and the layer is melted and rapidly cooled. Thus, a Cu-Sn composite material useful for electronic parts is obtd.
JP16518987A 1987-07-03 1987-07-03 Production of cu-sn composite material for electronic parts Granted JPS6411996A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16518987A JPS6411996A (en) 1987-07-03 1987-07-03 Production of cu-sn composite material for electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16518987A JPS6411996A (en) 1987-07-03 1987-07-03 Production of cu-sn composite material for electronic parts

Publications (2)

Publication Number Publication Date
JPS6411996A true JPS6411996A (en) 1989-01-17
JPH0510439B2 JPH0510439B2 (en) 1993-02-09

Family

ID=15807529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16518987A Granted JPS6411996A (en) 1987-07-03 1987-07-03 Production of cu-sn composite material for electronic parts

Country Status (1)

Country Link
JP (1) JPS6411996A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6424477B1 (en) 1988-11-02 2002-07-23 Hitachi, Ltd. Information signal recording and playback method and apparatus therefor
WO2003106739A1 (en) * 2002-06-13 2003-12-24 日本ニュークローム株式会社 Copper-tin-oxygen based alloy plating
JP2006307335A (en) * 2005-03-29 2006-11-09 Furukawa Electric Co Ltd:The Reflow treatment method for metal plating material, metal plating material, and reflow treatment device for metal plating material
JP2008075161A (en) * 2006-09-25 2008-04-03 Takamatsu Mekki:Kk Reflow treatment method of connection terminal
US7867625B2 (en) 2002-06-13 2011-01-11 Nihon New Chrome Co., Ltd. Copper-tin-oxygen alloy plating
JP2014198889A (en) * 2013-03-29 2014-10-23 Jx日鉱日石金属株式会社 Copper strip or copper alloy strip and radiation part provided with the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61284593A (en) * 1985-06-12 1986-12-15 Mitsubishi Electric Corp Manufacture of copper alloy bar for contact maker

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61284593A (en) * 1985-06-12 1986-12-15 Mitsubishi Electric Corp Manufacture of copper alloy bar for contact maker

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6424477B1 (en) 1988-11-02 2002-07-23 Hitachi, Ltd. Information signal recording and playback method and apparatus therefor
US6657831B2 (en) 1988-11-02 2003-12-02 Hitachi, Ltd. Information signal recording and playback method and apparatus therefor
US7019927B2 (en) 1988-11-02 2006-03-28 Hitachi, Ltd. Information signal recording and playback method and apparatus therefor
WO2003106739A1 (en) * 2002-06-13 2003-12-24 日本ニュークローム株式会社 Copper-tin-oxygen based alloy plating
US7157152B2 (en) 2002-06-13 2007-01-02 Nihon New Chrome Co., Ltd. Copper-tin-oxygen alloy plating
US7867625B2 (en) 2002-06-13 2011-01-11 Nihon New Chrome Co., Ltd. Copper-tin-oxygen alloy plating
JP2006307335A (en) * 2005-03-29 2006-11-09 Furukawa Electric Co Ltd:The Reflow treatment method for metal plating material, metal plating material, and reflow treatment device for metal plating material
JP2008075161A (en) * 2006-09-25 2008-04-03 Takamatsu Mekki:Kk Reflow treatment method of connection terminal
JP2014198889A (en) * 2013-03-29 2014-10-23 Jx日鉱日石金属株式会社 Copper strip or copper alloy strip and radiation part provided with the same

Also Published As

Publication number Publication date
JPH0510439B2 (en) 1993-02-09

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