JPS6411539U - - Google Patents

Info

Publication number
JPS6411539U
JPS6411539U JP1987103795U JP10379587U JPS6411539U JP S6411539 U JPS6411539 U JP S6411539U JP 1987103795 U JP1987103795 U JP 1987103795U JP 10379587 U JP10379587 U JP 10379587U JP S6411539 U JPS6411539 U JP S6411539U
Authority
JP
Japan
Prior art keywords
semiconductor element
bump electrodes
light transmission
junctions
melted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987103795U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0517884Y2 (ja�@�@
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987103795U priority Critical patent/JPH0517884Y2/ja
Publication of JPS6411539U publication Critical patent/JPS6411539U/ja
Application granted granted Critical
Publication of JPH0517884Y2 publication Critical patent/JPH0517884Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Clocks (AREA)
  • Wire Bonding (AREA)
JP1987103795U 1987-07-08 1987-07-08 Expired - Lifetime JPH0517884Y2 (ja�@�@)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987103795U JPH0517884Y2 (ja�@�@) 1987-07-08 1987-07-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987103795U JPH0517884Y2 (ja�@�@) 1987-07-08 1987-07-08

Publications (2)

Publication Number Publication Date
JPS6411539U true JPS6411539U (ja�@�@) 1989-01-20
JPH0517884Y2 JPH0517884Y2 (ja�@�@) 1993-05-13

Family

ID=31334944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987103795U Expired - Lifetime JPH0517884Y2 (ja�@�@) 1987-07-08 1987-07-08

Country Status (1)

Country Link
JP (1) JPH0517884Y2 (ja�@�@)

Also Published As

Publication number Publication date
JPH0517884Y2 (ja�@�@) 1993-05-13

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