JPS6411071B2 - - Google Patents
Info
- Publication number
- JPS6411071B2 JPS6411071B2 JP11132081A JP11132081A JPS6411071B2 JP S6411071 B2 JPS6411071 B2 JP S6411071B2 JP 11132081 A JP11132081 A JP 11132081A JP 11132081 A JP11132081 A JP 11132081A JP S6411071 B2 JPS6411071 B2 JP S6411071B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- weight
- parts
- silicon
- curable composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000203 mixture Substances 0.000 claims description 26
- 229920000570 polyether Polymers 0.000 claims description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 19
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 18
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 12
- 229910052717 sulfur Inorganic materials 0.000 claims description 12
- 239000011593 sulfur Substances 0.000 claims description 12
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- -1 hydride group Chemical group 0.000 claims description 6
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- 125000002947 alkylene group Chemical group 0.000 claims description 3
- 125000004434 sulfur atom Chemical group 0.000 claims description 3
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical group NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 claims description 2
- 125000004423 acyloxy group Chemical group 0.000 claims description 2
- 125000003302 alkenyloxy group Chemical group 0.000 claims description 2
- 125000003368 amide group Chemical group 0.000 claims description 2
- 125000002344 aminooxy group Chemical group [H]N([H])O[*] 0.000 claims description 2
- 125000005843 halogen group Chemical group 0.000 claims description 2
- 150000002894 organic compounds Chemical class 0.000 claims description 2
- 125000005372 silanol group Chemical group 0.000 claims description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 2
- KZMAWJRXKGLWGS-UHFFFAOYSA-N 2-chloro-n-[4-(4-methoxyphenyl)-1,3-thiazol-2-yl]-n-(3-methoxypropyl)acetamide Chemical compound S1C(N(C(=O)CCl)CCCOC)=NC(C=2C=CC(OC)=CC=2)=C1 KZMAWJRXKGLWGS-UHFFFAOYSA-N 0.000 claims 1
- 150000002430 hydrocarbons Chemical group 0.000 claims 1
- 239000000945 filler Substances 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000003054 catalyst Substances 0.000 description 10
- 230000005494 condensation Effects 0.000 description 9
- 238000009833 condensation Methods 0.000 description 9
- 239000004014 plasticizer Substances 0.000 description 9
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 description 4
- 239000004927 clay Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 4
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 3
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 3
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- NXQMCAOPTPLPRL-UHFFFAOYSA-N 2-(2-benzoyloxyethoxy)ethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOCCOC(=O)C1=CC=CC=C1 NXQMCAOPTPLPRL-UHFFFAOYSA-N 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 239000000440 bentonite Substances 0.000 description 2
- 229910000278 bentonite Inorganic materials 0.000 description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000004359 castor oil Substances 0.000 description 2
- 235000019438 castor oil Nutrition 0.000 description 2
- 229910052570 clay Inorganic materials 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000003517 fume Substances 0.000 description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 2
- 239000001095 magnesium carbonate Substances 0.000 description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 235000014692 zinc oxide Nutrition 0.000 description 2
- LFMQNMXVVXHZCC-UHFFFAOYSA-N 1,3-benzothiazol-2-yl n,n-diethylcarbamodithioate Chemical compound C1=CC=C2SC(SC(=S)N(CC)CC)=NC2=C1 LFMQNMXVVXHZCC-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
- VYVFQBFOMKEKBG-UHFFFAOYSA-L 3,3-dibutyl-2,4,3-benzodioxastannepine-1,5-dione Chemical compound O=C1O[Sn](CCCC)(CCCC)OC(=O)C2=CC=CC=C21 VYVFQBFOMKEKBG-UHFFFAOYSA-L 0.000 description 1
- CPGFMWPQXUXQRX-UHFFFAOYSA-N 3-amino-3-(4-fluorophenyl)propanoic acid Chemical compound OC(=O)CC(N)C1=CC=C(F)C=C1 CPGFMWPQXUXQRX-UHFFFAOYSA-N 0.000 description 1
- QJIVRICYWXNTKE-UHFFFAOYSA-N 4-(8-methylnonoxy)-4-oxobutanoic acid Chemical compound CC(C)CCCCCCCOC(=O)CCC(O)=O QJIVRICYWXNTKE-UHFFFAOYSA-N 0.000 description 1
- UWSMKYBKUPAEJQ-UHFFFAOYSA-N 5-Chloro-2-(3,5-di-tert-butyl-2-hydroxyphenyl)-2H-benzotriazole Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O UWSMKYBKUPAEJQ-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- PYGXAGIECVVIOZ-UHFFFAOYSA-N Dibutyl decanedioate Chemical compound CCCCOC(=O)CCCCCCCCC(=O)OCCCC PYGXAGIECVVIOZ-UHFFFAOYSA-N 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- 229920001875 Ebonite Polymers 0.000 description 1
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 1
- 241000975357 Salangichthys microdon Species 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- AFZSMODLJJCVPP-UHFFFAOYSA-N dibenzothiazol-2-yl disulfide Chemical compound C1=CC=C2SC(SSC=3SC4=CC=CC=C4N=3)=NC2=C1 AFZSMODLJJCVPP-UHFFFAOYSA-N 0.000 description 1
- PGAXJQVAHDTGBB-UHFFFAOYSA-N dibutylcarbamothioylsulfanyl n,n-dibutylcarbamodithioate Chemical compound CCCCN(CCCC)C(=S)SSC(=S)N(CCCC)CCCC PGAXJQVAHDTGBB-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- AUZONCFQVSMFAP-UHFFFAOYSA-N disulfiram Chemical compound CCN(CC)C(=S)SSC(=S)N(CC)CC AUZONCFQVSMFAP-UHFFFAOYSA-N 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 239000005003 food packaging material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000004678 hydrides Chemical group 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- WIBFFTLQMKKBLZ-SEYXRHQNSA-N n-butyl oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCCC WIBFFTLQMKKBLZ-SEYXRHQNSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- YAFOVCNAQTZDQB-UHFFFAOYSA-N octyl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(OCCCCCCCC)OC1=CC=CC=C1 YAFOVCNAQTZDQB-UHFFFAOYSA-N 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical class OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- BPJZKLBPJBMLQG-KWRJMZDGSA-N propanoyl (z,12r)-12-hydroxyoctadec-9-enoate Chemical compound CCCCCC[C@@H](O)C\C=C/CCCCCCCC(=O)OC(=O)CC BPJZKLBPJBMLQG-KWRJMZDGSA-N 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052990 silicon hydride Inorganic materials 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
- 229960002447 thiram Drugs 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- NEYNBSGIXOOZGZ-UHFFFAOYSA-L zinc;butoxymethanedithioate Chemical compound [Zn+2].CCCCOC([S-])=S.CCCCOC([S-])=S NEYNBSGIXOOZGZ-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、水分に触れるとゴム様物質へと室温
硬化しうる加水分解性珪素基及び/又はシラノー
ル基含有ポリエーテルと、イオウ含有化合物とを
有効成分として含有する組成物に関する。
本発明者らは既に湿分硬化性珪素基を有するポ
リエーテルが密封剤として有用であることを見い
出し、その製造法及び組成物につき先に提案し
た。湿分硬化性珪素基を有するポリエーテルを主
成分とする室温硬化性密封剤は、安価で優れた性
能を有しているが、配合組成によつては金属に対
する接着性が不充分であつた。
本発明者らは、この点を改良すべく鋭意検討を
重ねた結果、イオウ含有化合物を添加することに
より、湿分硬化性珪素基を有するポリエーテルの
優れた性質を損うことなく、目的が達せられるこ
とを見出し、本発明に到達した。
すなわち本発明は、A少くとも1つの加水分解
性珪素基及び/又はシラノール基を含有し、主鎖
が本質的に−R−O−(Rは2価のアルキレン基)
で示される化学的に結合された繰り返し単位を有
するものであつて、且つ分子量が500〜15000であ
るポリエーテル、100重量部と、B無機イオウま
たは分子内に少なくとも2原子以上のイオウ原子
を含む有機化合物、0.01〜20重量部とを含有する
室温硬化性組成物に関する。
本発明において室温硬化性珪素基を有するポリ
エーテルとは、主鎖が本質的に−R−O−(Rは
2価のアルキレン基)で示される化学的に結合し
た繰り返し単位を有するものであつて、且つ分子
量が500〜15000であるポリエーテルからなり、1
分子中に少なくとも1個の珪素原子に結合した加
水分解性基を有する重合体である。ここで本質的
に−R−O−単位を有するものとは、後述するご
とくポリエーテルの製造方法によつては少量の他
の結合単位を含みうることを示すものである。珪
素原子に結合した加水分解性基としては、代表的
にはハイドライド基、ハロゲン基、アルコキシ
基、アシルオキシ基、ケトキシメート基、アミド
基、酸アミド基、アミノオキシ基、メルカプト基
およびアルケニルオキシ基が挙げられる。
室温硬化性珪素基を有するポリエーテルは、公
知の種々の方法で製造しうるが、好ましくは式
(ここで、aは0〜2の整数、R1は1価の炭
化水素基、Xは加水分解性基を示す)の水素化珪
素化合物と、
式
(R2は水素又は炭素数1〜20の1価の有機基、
R3は炭素数1〜20の2価の有機基、bは0又は
1の整数)
の末端オレフイン基を有するポリエーテルとを反
応させることにより得られる、末端に
The present invention relates to a composition containing as active ingredients a hydrolyzable silicon- and/or silanol-containing polyether that can cure at room temperature into a rubber-like substance on contact with moisture, and a sulfur-containing compound. The present inventors have already discovered that moisture-curable polyethers having silicon groups are useful as sealants, and have previously proposed methods and compositions for their production. Room-temperature-curing sealants whose main component is moisture-curable polyether with silicon groups are inexpensive and have excellent performance, but depending on the composition, their adhesion to metals is insufficient. . As a result of intensive studies to improve this point, the present inventors found that by adding a sulfur-containing compound, the objective could be achieved without impairing the excellent properties of moisture-curable polyether having silicon groups. They have discovered that it can be achieved, and have arrived at the present invention. That is, the present invention provides A containing at least one hydrolyzable silicon group and/or silanol group, and the main chain is essentially -R-O- (R is a divalent alkylene group).
100 parts by weight of a polyether having chemically bonded repeating units represented by the formula and having a molecular weight of 500 to 15,000, and B: inorganic sulfur or containing at least two or more sulfur atoms in the molecule. The present invention relates to a room temperature curable composition containing 0.01 to 20 parts by weight of an organic compound. In the present invention, a room-temperature-curable polyether having a silicon group is one whose main chain essentially has chemically bonded repeating units represented by -R-O- (R is a divalent alkylene group). and is made of polyether with a molecular weight of 500 to 15,000, and 1
It is a polymer having in its molecule at least one hydrolyzable group bonded to a silicon atom. Here, what is meant by essentially having -R-O- units means that the polyether may contain a small amount of other bonding units depending on the method for producing the polyether, as described below. Hydrolyzable groups bonded to silicon atoms typically include hydride groups, halogen groups, alkoxy groups, acyloxy groups, ketoximate groups, amide groups, acid amide groups, aminooxy groups, mercapto groups, and alkenyloxy groups. It will be done. Room-temperature-curable polyethers having silicon groups can be produced by various known methods, but are preferably produced by the formula (Here, a is an integer of 0 to 2, R1 is a monovalent hydrocarbon group, and X is a hydrolyzable group); and a silicon hydride compound of the formula ( R2 is hydrogen or a monovalent organic group having 1 to 20 carbon atoms,
R 3 is a divalent organic group having 1 to 20 carbon atoms, and b is an integer of 0 or 1.
【式】で示されるシリ
ル基を有するポリエーテルが挙げられる。この種
のポリエーテルは具体的には特開昭50−156599、
特開昭54−6096、特開昭55−13768、特開昭55−
82123、特開昭55−131022に開示されている方法
により得ることができる。これ以外にも、特開昭
55−13767、特開昭55−123620、特開昭55−
125121、特開昭55−131021、特開昭55−137129、
特開昭55−135135に開示されている方法により得
られる室温硬化性珪素基を有するポリエーテルも
使用することができる。これらのポリエーテルは
一種類のみを用いてもよいし、二種類以上を混合
して用いてもよい。
本発明で用いることのできるイオウ含有化合物
とは、無機イオウ(単斜、斜方、非晶)、及びイ
オウ原子を分子中に少くとも2原子以上、好まし
くは4原子以上含有する有機イオウ化合物で、後
者の具体例としてはジベンゾチアジルジスルフイ
ド、2−(N,N−ジエチルチオカルバモイルチ
オ)ベンゾチアゾール、2−(4′−モルホリノジ
チオ)ベンゾチアゾール、テトラメチルチウラム
ジスルフイド、テトラエチルチウラムジスルフイ
ド、テトラブチルチウラムジスルフイド、ジペン
タメチレンチウラムテトラスルフイド、ブチルキ
サントゲン酸亜鉛、およびポリサルフアイド等が
例示できる。又、これらのイオウ含有化合物を含
む組成物、例えばエボナイト等も添加することが
できる。これらのイオウ含有化合物は一種類のみ
を用いてもよいし、二種類以上を混合して用いて
もよい。イオウ含有化合物は、シリル基含有ポリ
エーテル100重量部に対し0.01〜20重量部の範囲
で添加すれば効果があり、好ましくは0.1〜5重
量部の範囲で使用するのがよい。0.01重量部未満
では効果が小さく、また20重量部をこえると物性
への悪影響が出ることがある。
本発明により接着性が改良される金属として
は、アルミニウム、ニツケル、鉄、亜鉛、青銅、
黄銅、ステンレス等が挙げられるが、特にアルミ
ニウムに対する効果が顕著である。
本発明の組成物を硬化させるにあたつては、シ
ラノール縮合触媒を使用してもしなくてもよい。
縮合触媒を使用する場合は、アルキルチタン酸
塩;有機珪素チタン酸塩;オクチル酸錫、ジブチ
ル錫ラウシートおよびジブチル錫マンエート、ジ
ブチル錫フタレートなどの如きカルボン酸の金属
塩;ジブチルアミン−2−エチルヘキソエートな
どの如きアミン酸;ならびに他の酸性触媒および
塩基性触媒など公知のシラノール縮合触媒が有効
に使用される。これら縮合触媒の量は珪素含有ポ
リエーテルに対し、0〜10重量%で使用するのが
好ましい。加水分解性基Xとしてアルコキシ基が
使用される場合には、この重合体のみでは硬化速
度が遅いので、縮合触媒を使用する事が好まし
い。この場合、縮合触媒としては錫のカルボン酸
塩が特に好ましい。
本発明の珪素含有ポリエーテルは、種々の充填
剤を配合する事により変性しうる。充填剤として
は、フユームシリカ、沈降性シリカ、無水珪酸、
含水珪酸およびカーボンブラツクの如き補強性充
填剤;炭酸カルシウム、炭酸マグネシウム、ケイ
ソウ土、焼成クレー、クレー、タルク、酸化チタ
ン、ベントナイト、有機ベントナイト、酸化第二
鉄、酸化亜鉛、活性亜鉛華、水添ヒマシ油および
シラスバルーンなどの如き充填剤;石綿、ガラス
繊維およびフイラメントの如き繊維状充填剤が使
用できる。これら充填剤で強度の高い硬化組成物
を得たい場合には、主にフユームシリカ、沈降性
シリカ無水珪酸、含水珪酸、カーボンブラツク、
表面処理微細炭酸カルシウム、焼成クレー、クレ
ーおよび活性亜鉛華などから選ばれる充填剤を珪
素末端ポリエーテル100重量部に対し1〜100重量
部の範囲で使用すれば好ましい結果が得られる。
又、低強度で伸びが大である硬化組成物を得たい
場合には、主に酸化チタン、炭酸カルシウム、炭
酸マグネシウム、タルク、酸化第二鉄、酸化亜鉛
およびシラスバルーンなどから選ばれる充填剤を
珪素含有ポリエーテル100重量部に対し5〜200重
量部の範囲で使用すれば好ましい結果が得られ
る。もちろんこれら充填剤は1種類のみで使用し
てもよいし、2種類以上混合使用してもよい。
本発明において、可塑剤を充填剤と併用して使
用すると硬化物の伸びを大きくできたり、多量の
充填剤を混入できたりするのでより有効である。
該可塑剤としては、一般によく使用されている、
例えばジオクチルフタレート、ジブチルフタレー
ト、ブチルベンジルフタレートなどの如きフタル
酸エステル類;アジピン酸ジオクチル、コハク酸
イソデシル、セバシン酸ジブチルなどの如き脂肪
族2塩基酸エステル類;ジエチレングリコールジ
ベンゾエート、ペンタエリスリトールエステルな
どの如きグリコールエステル類;オレイン酸ブチ
ル、アセチルリシノール酸メチルなどの如き脂肪
族エステル類;リン酸トリクレジル、リン酸トリ
オクチル、リン酸オクチルジフエニルなどの如き
リン酸エステル類;エポキシ化大豆油、エポキシ
ステアリン酸ベンジルなどの如きエポキシ可塑剤
類;塩素化パラフインなどの可塑剤が単独又は2
種類以上の混合物の形で任意に使用出来る。可塑
剤量は、珪素含有ポリエーテル100重量部に対し
0〜100重量部の範囲で使用すると好ましい結果
が得られる。本発明における配合組成物では充填
剤、可塑剤、縮合触媒が主に使用されるが、フエ
ノール樹脂およびエポキシ樹脂などの如き接着付
与剤、顔料、老化防止剤、紫外線吸収剤などの如
き添加剤も任意に使用される事も包含される。
本発明組成物においては、1液組成物および2
液組成物のいずれも可能である。2液組成物とし
て使用する場合には、例えば珪素含有ポリエーテ
ル、有機シラン重合体、充填剤および可塑剤から
成る成分と充填剤、可塑剤および縮合触媒からな
る成分とにわけ、使用直前に両成分を混合し使用
すれば良好な結果が得られる。1液組成物として
使用する場合には、珪素含有ポリエーテル、有機
シラン重合体、充填剤、可塑剤および縮合触媒を
充分脱水乾燥してから水分非存在下で混合し、カ
ートリツジなどに保存しておけば保存安定性良好
な1液組成物としても使用可能である。
本発明組成物は1液および2液の弾性シーラン
トとして特に有用であり、建造物、船舶、自動
車、道路などの密封剤として使用しうる。更に、
単独あるいはプライマーの助けをかりて、ガラ
ス、磁器、木材、金属、樹脂成型物などの如き広
範囲の基質に密着しうるので、種々のタイプの密
封組成物および接着組成物としても使用可能であ
る。更に、食品包装材料、注型ゴム材料、型取り
用材料、塗料としても有用である。
以下具体的に実施例を挙げて説明する。
実施例 1
平均分子量8000、末端基として
Examples include polyethers having a silyl group represented by the formula: Specifically, this type of polyether is disclosed in Japanese Patent Application Laid-open No. 50-156599,
Unexamined Japanese Patent Publications 1986-6096, 13768-1980, 1982-13768
82123, by the method disclosed in JP-A-55-131022. In addition to this, Tokukai Sho
55-13767, JP-A-55-123620, JP-A-55-
125121, JP 55-131021, JP 55-137129,
It is also possible to use polyethers containing room temperature curable silicon groups obtained by the method disclosed in JP-A-55-135135. These polyethers may be used alone or in combination of two or more. The sulfur-containing compounds that can be used in the present invention include inorganic sulfur (monoclinic, orthorhombic, amorphous) and organic sulfur compounds containing at least 2 or more, preferably 4 or more, sulfur atoms in the molecule. , Specific examples of the latter include dibenzothiazyl disulfide, 2-(N,N-diethylthiocarbamoylthio)benzothiazole, 2-(4'-morpholinodithio)benzothiazole, tetramethylthiuram disulfide, and tetraethylthiuram. Examples include disulfide, tetrabutylthiuram disulfide, dipentamethylenethiuram tetrasulfide, zinc butylxanthate, and polysulfide. Compositions containing these sulfur-containing compounds, such as ebonite, can also be added. These sulfur-containing compounds may be used alone or in combination of two or more. The sulfur-containing compound is effective if added in an amount of 0.01 to 20 parts by weight per 100 parts by weight of the silyl group-containing polyether, and preferably in an amount of 0.1 to 5 parts by weight. If the amount is less than 0.01 part by weight, the effect will be small, and if it exceeds 20 parts by weight, the physical properties may be adversely affected. Metals whose adhesion is improved by the present invention include aluminum, nickel, iron, zinc, bronze,
Examples include brass and stainless steel, but the effect on aluminum is particularly remarkable. In curing the composition of the present invention, a silanol condensation catalyst may or may not be used.
If condensation catalysts are used, alkyl titanates; organosilicon titanates; metal salts of carboxylic acids such as tin octylate, dibutyltin lausite and dibutyltin manate, dibutyltin phthalate; dibutylamine-2-ethyl Known silanol condensation catalysts such as amino acids such as xoates; and other acidic and basic catalysts are usefully used. The amount of these condensation catalysts is preferably 0 to 10% by weight based on the silicon-containing polyether. When an alkoxy group is used as the hydrolyzable group X, it is preferable to use a condensation catalyst since the curing rate is slow if this polymer alone is used. In this case, a tin carboxylate is particularly preferred as the condensation catalyst. The silicon-containing polyether of the present invention can be modified by incorporating various fillers. Fillers include fume silica, precipitated silica, silicic anhydride,
Reinforcing fillers such as hydrated silicic acid and carbon black; calcium carbonate, magnesium carbonate, diatomaceous earth, calcined clay, clay, talc, titanium oxide, bentonite, organic bentonite, ferric oxide, zinc oxide, activated zinc white, hydrogenated Fillers such as castor oil and whitebait balloons; fibrous fillers such as asbestos, glass fibers and filaments can be used. If you want to obtain a hardened composition with high strength using these fillers, you can use mainly fume silica, precipitated silica, anhydrous silicic acid, hydrous silicic acid, carbon black,
Favorable results can be obtained if a filler selected from surface-treated finely divided calcium carbonate, calcined clay, clay and activated zinc white is used in an amount of 1 to 100 parts by weight per 100 parts by weight of silicon-terminated polyether.
In addition, when it is desired to obtain a cured composition with low strength and high elongation, fillers mainly selected from titanium oxide, calcium carbonate, magnesium carbonate, talc, ferric oxide, zinc oxide, and shirasu balloon are used. Favorable results can be obtained if it is used in an amount of 5 to 200 parts by weight per 100 parts by weight of the silicon-containing polyether. Of course, these fillers may be used alone or in a mixture of two or more. In the present invention, it is more effective to use a plasticizer in combination with a filler because the elongation of the cured product can be increased and a large amount of filler can be mixed.
As the plasticizer, commonly used
For example, phthalate esters such as dioctyl phthalate, dibutyl phthalate, butylbenzyl phthalate; aliphatic dibasic acid esters such as dioctyl adipate, isodecyl succinate, dibutyl sebacate; and diethylene glycol dibenzoate, pentaerythritol ester, etc. Glycol esters; Aliphatic esters such as butyl oleate, methyl acetyl ricinoleate, etc.; Phosphate esters such as tricresyl phosphate, trioctyl phosphate, octyl diphenyl phosphate, etc.; Epoxidized soybean oil, benzyl epoxy stearate Epoxy plasticizers such as; plasticizers such as chlorinated paraffin alone or in combination
It can be used arbitrarily in the form of a mixture of more than one type. Preferable results are obtained when the amount of plasticizer is used in the range of 0 to 100 parts by weight per 100 parts by weight of the silicon-containing polyether. Fillers, plasticizers, condensation catalysts are mainly used in the compounded composition of the present invention, but additives such as adhesion promoters such as phenolic resins and epoxy resins, pigments, anti-aging agents, ultraviolet absorbers, etc. are also used. It also includes being used arbitrarily. The composition of the present invention includes a one-part composition and a two-part composition.
Any liquid composition is possible. When used as a two-component composition, for example, a component consisting of a silicon-containing polyether, an organic silane polymer, a filler, and a plasticizer and a component consisting of a filler, plasticizer, and condensation catalyst are separated, and both components are mixed immediately before use. Good results can be obtained by using a mixture of the ingredients. When used as a one-component composition, the silicon-containing polyether, organic silane polymer, filler, plasticizer, and condensation catalyst are sufficiently dehydrated and dried, then mixed in the absence of moisture, and stored in a cartridge or the like. It can also be used as a one-component composition with good storage stability. The compositions of the present invention are particularly useful as one-part and two-part elastic sealants and can be used as sealants for buildings, ships, automobiles, roads, etc. Furthermore,
It can be used alone or with the aid of a primer to adhere to a wide range of substrates such as glass, porcelain, wood, metal, resin moldings, etc., and therefore can be used in various types of sealing compositions and adhesive compositions. Furthermore, it is useful as a food packaging material, a casting rubber material, a molding material, and a paint. Examples will be specifically described below. Example 1 Average molecular weight 8000, as a terminal group
【式】基を全末端
基のうち80%有するポリプロピレンオキシド100
重量部に対しエポキシヘキサヒドロフタル酸ジオ
クチル20重量部、ジオクチルフタレート20重量
部、脂肪酸処理炭酸カルシウム120重量部、水添
ヒマシ油6重量部、酸化チタン8重量部、カーボ
ンブラツク0.5重量部、2,2′−メチレン−ビス
−(4−メチル−6−tert−ブチルフエノール)
1重量部、2(2′−ヒドロキシ−3′、5′−ジ−tert
−ブチルフエニル)−5−クロロベンゾトリアゾ
ール1重量部、光硬化性オリゴマー(商品名:ア
ロニクスM8060、東亜合成化学工業製)5重量部
および無機イオウ0.3重量部を加え、三本ペイン
トロールで混合して主剤を作製した。これとは別
にオクチル酸錫3重量部、ラウリルアミン0.75重
量部、ジオクチルフタレート6.25重量部、酸化チ
タン20重量部を加えホモジナイザーで混合、分散
し硬化剤を作製した。
このようにして得られた主剤と硬化剤を10:1
の重量比で混合し、JIS−A−5758に従つて陽極
酸化アルミ板のH型試験片を作製し、表1に示し
た硬化条件で硬化させた後の物性を測定した。結
果を、イオウを0.3重量部加えない以外は実施例
1と同じ条件で行つた比較例と共に表−1に示
す。
表中、界面破壊は破断時にアルミ板と硬化物界
面での剥離を示し、凝集破壊は硬化物自体の破断
を示す。またRTとあるのは室温、STDとあるの
はJIS規定の標準養生条件(室温7日+50℃で7
日)を示す。[Formula] Polypropylene oxide 100 with 80% of all end groups
20 parts by weight of epoxyhexahydrophthalate dioctyl, 20 parts by weight of dioctyl phthalate, 120 parts by weight of fatty acid-treated calcium carbonate, 6 parts by weight of hydrogenated castor oil, 8 parts by weight of titanium oxide, 0.5 parts by weight of carbon black, 2, 2'-methylene-bis-(4-methyl-6-tert-butylphenol)
1 part by weight, 2(2'-hydroxy-3',5'-di-tert
-butylphenyl)-5-chlorobenzotriazole (1 part by weight), 5 parts by weight of a photocurable oligomer (trade name: Aronix M8060, manufactured by Toagosei Chemical Industry Co., Ltd.) and 0.3 parts by weight of inorganic sulfur were added and mixed with three paint rolls. The main ingredient was prepared. Separately, 3 parts by weight of tin octylate, 0.75 parts by weight of laurylamine, 6.25 parts by weight of dioctyl phthalate, and 20 parts by weight of titanium oxide were added and mixed and dispersed using a homogenizer to prepare a curing agent. The base resin and curing agent obtained in this way were mixed in a ratio of 10:1.
An H-type test piece of an anodized aluminum plate was prepared according to JIS-A-5758, and the physical properties were measured after curing under the curing conditions shown in Table 1. The results are shown in Table 1 together with a comparative example conducted under the same conditions as Example 1 except that 0.3 parts by weight of sulfur was not added. In the table, interfacial failure indicates separation at the interface between the aluminum plate and the cured product at the time of breakage, and cohesive failure indicates breakage of the cured product itself. Also, RT refers to room temperature, and STD refers to the standard curing conditions specified by JIS (7 days at room temperature + 50℃).
day).
【表】
実施例 2
実施例1におけるイオウ0.3重量部の替りにジ
ペンタエチレンチウラムテトラスルフイド1重量
部を使用する以外は同じ条件で行つた。結果を表
−2に示す。[Table] Example 2 The same conditions as in Example 1 were carried out except that 1 part by weight of dipentaethylenethiuram tetrasulfide was used instead of 0.3 part by weight of sulfur. The results are shown in Table-2.
Claims (1)
又はシラノール基を含有し、主鎖が本質的に−R
−O−(Rは2価のアルキレン基)で示される化
学的に結合された繰り返し単位を有するものであ
つて、且つ分子量が500〜15000であるポリエーテ
ル、100重量部とB無機イオウまたは分子内に少
なくとも2原子以上のイオウ原子を含む有機化合
物、0.01〜20重量部とを含有することを特徴とす
る室温硬化性組成物。 2 加水分解性珪素基が珪素原子に結合したハイ
ドライド基、ハロゲン基、アルコキシ基、アシル
オキシ基、ケトキシメート基、アミド基、酸アミ
ド基、アミノキシ基、メルカプト基およびアルケ
ニルオキシ基からなる群より選ばれる少くとも1
種である特許請求の範囲第1項記載の室温硬化性
組成物。 3 加水分解性珪素基が式【式】(ここ で、aは0〜2の整数、R1は1価の炭化水素基、
Xは加水分解性基を示す)で示される特許請求の
範囲第1項記載の室温硬化性組成物。 4 XがCH3O−基である特許請求の範囲第3項
記載の室温硬化性組成物。[Claims] 1. A at least one hydrolyzable silicon group and/or
or contains a silanol group, and the main chain is essentially -R
100 parts by weight of polyether having chemically bonded repeating units represented by -O- (R is a divalent alkylene group) and having a molecular weight of 500 to 15,000 and B inorganic sulfur or molecule 1. A room-temperature curable composition comprising 0.01 to 20 parts by weight of an organic compound containing at least two or more sulfur atoms. 2 A group consisting of a hydride group in which a hydrolyzable silicon group is bonded to a silicon atom, a halogen group, an alkoxy group, an acyloxy group, a ketoximate group, an amide group, an acid amide group, an aminoxy group, a mercapto group, and an alkenyloxy group. Tomo1
The room temperature curable composition according to claim 1, which is a seed. 3 The hydrolyzable silicon group has the formula [Formula] (where a is an integer of 0 to 2, R 1 is a monovalent hydrocarbon group,
The room-temperature curable composition according to claim 1, wherein X represents a hydrolyzable group. 4. The room temperature curable composition according to claim 3, wherein X is a CH3O- group.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11132081A JPS5813655A (en) | 1981-07-15 | 1981-07-15 | Composition curable at room temperature |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11132081A JPS5813655A (en) | 1981-07-15 | 1981-07-15 | Composition curable at room temperature |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5813655A JPS5813655A (en) | 1983-01-26 |
JPS6411071B2 true JPS6411071B2 (en) | 1989-02-23 |
Family
ID=14558224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11132081A Granted JPS5813655A (en) | 1981-07-15 | 1981-07-15 | Composition curable at room temperature |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5813655A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59138259A (en) * | 1983-01-29 | 1984-08-08 | Kanegafuchi Chem Ind Co Ltd | Curable composition |
ATE353352T1 (en) * | 2001-05-02 | 2007-02-15 | Borealis Tech Oy | USE OF POLYSULPHIDES FOR STABILIZING POLYMERS CONTAINING CROSS-LINKED SILANE GROUPS |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5522481B2 (en) * | 1972-12-27 | 1980-06-17 | ||
JPS59524B2 (en) * | 1979-03-30 | 1984-01-07 | 信越化学工業株式会社 | Method for producing silicone-modified polyoxyalkylene |
-
1981
- 1981-07-15 JP JP11132081A patent/JPS5813655A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5813655A (en) | 1983-01-26 |
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