JPS6411025U - - Google Patents
Info
- Publication number
- JPS6411025U JPS6411025U JP10623187U JP10623187U JPS6411025U JP S6411025 U JPS6411025 U JP S6411025U JP 10623187 U JP10623187 U JP 10623187U JP 10623187 U JP10623187 U JP 10623187U JP S6411025 U JPS6411025 U JP S6411025U
- Authority
- JP
- Japan
- Prior art keywords
- plate surface
- side plate
- electrode
- holding portion
- piezoelectric diaphragm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP10623187U JPS6411025U (cs) | 1987-07-10 | 1987-07-10 | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP10623187U JPS6411025U (cs) | 1987-07-10 | 1987-07-10 | 
Publications (1)
| Publication Number | Publication Date | 
|---|---|
| JPS6411025U true JPS6411025U (cs) | 1989-01-20 | 
Family
ID=31339553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP10623187U Pending JPS6411025U (cs) | 1987-07-10 | 1987-07-10 | 
Country Status (1)
| Country | Link | 
|---|---|
| JP (1) | JPS6411025U (cs) | 
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS5643748A (en) * | 1979-09-17 | 1981-04-22 | Seiko Instr & Electronics Ltd | Mounting structure for ic | 
| JPS58202540A (ja) * | 1982-05-21 | 1983-11-25 | Nippon Telegr & Teleph Corp <Ntt> | スタンド・オフによるボンデイング微細位置合せ方法 | 
| JPS6247074B2 (cs) * | 1980-03-22 | 1987-10-06 | Nippon Steel Welding Prod Eng | 
- 
        1987
        - 1987-07-10 JP JP10623187U patent/JPS6411025U/ja active Pending
 
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS5643748A (en) * | 1979-09-17 | 1981-04-22 | Seiko Instr & Electronics Ltd | Mounting structure for ic | 
| JPS6247074B2 (cs) * | 1980-03-22 | 1987-10-06 | Nippon Steel Welding Prod Eng | |
| JPS58202540A (ja) * | 1982-05-21 | 1983-11-25 | Nippon Telegr & Teleph Corp <Ntt> | スタンド・オフによるボンデイング微細位置合せ方法 |