JPS6398654U - - Google Patents

Info

Publication number
JPS6398654U
JPS6398654U JP1986194758U JP19475886U JPS6398654U JP S6398654 U JPS6398654 U JP S6398654U JP 1986194758 U JP1986194758 U JP 1986194758U JP 19475886 U JP19475886 U JP 19475886U JP S6398654 U JPS6398654 U JP S6398654U
Authority
JP
Japan
Prior art keywords
metal substrates
circuit
conductive path
conductive pads
thin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986194758U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986194758U priority Critical patent/JPS6398654U/ja
Publication of JPS6398654U publication Critical patent/JPS6398654U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1986194758U 1986-12-18 1986-12-18 Pending JPS6398654U (US20090158533A1-20090625-C00001.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986194758U JPS6398654U (US20090158533A1-20090625-C00001.png) 1986-12-18 1986-12-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986194758U JPS6398654U (US20090158533A1-20090625-C00001.png) 1986-12-18 1986-12-18

Publications (1)

Publication Number Publication Date
JPS6398654U true JPS6398654U (US20090158533A1-20090625-C00001.png) 1988-06-25

Family

ID=31152026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986194758U Pending JPS6398654U (US20090158533A1-20090625-C00001.png) 1986-12-18 1986-12-18

Country Status (1)

Country Link
JP (1) JPS6398654U (US20090158533A1-20090625-C00001.png)

Similar Documents

Publication Publication Date Title
JPS6398654U (US20090158533A1-20090625-C00001.png)
JPH0349415Y2 (US20090158533A1-20090625-C00001.png)
JPS6365246U (US20090158533A1-20090625-C00001.png)
JPS6365245U (US20090158533A1-20090625-C00001.png)
JPS5937737U (ja) 集積回路塔載ボ−ド
JPS6380859U (US20090158533A1-20090625-C00001.png)
JPS6365263U (US20090158533A1-20090625-C00001.png)
JPH0231067U (US20090158533A1-20090625-C00001.png)
JPS63131163U (US20090158533A1-20090625-C00001.png)
JPS6448068U (US20090158533A1-20090625-C00001.png)
JPS5863704U (ja) チツプ抵抗器
JPS63131171U (US20090158533A1-20090625-C00001.png)
JPS62104458U (US20090158533A1-20090625-C00001.png)
JPS6146768U (ja) 金属ベ−スプリント回路基板の電気的接続構造
JPS6251777U (US20090158533A1-20090625-C00001.png)
JPS594610U (ja) インダクタンス素子
JPS61146977U (US20090158533A1-20090625-C00001.png)
JPS63131146U (US20090158533A1-20090625-C00001.png)
JPS58105162U (ja) フレキシブル基板
JPS60116610U (ja) 薄膜磁気ヘツド
JPS6343430U (US20090158533A1-20090625-C00001.png)
JPS59101459U (ja) 厚膜配線基板の端子部構造
JPS59143070U (ja) 集積回路基板
JPS60130518U (ja) 複写機内の電気部品結線装置
JPS61157359U (US20090158533A1-20090625-C00001.png)