JPS6395238U - - Google Patents
Info
- Publication number
- JPS6395238U JPS6395238U JP19061286U JP19061286U JPS6395238U JP S6395238 U JPS6395238 U JP S6395238U JP 19061286 U JP19061286 U JP 19061286U JP 19061286 U JP19061286 U JP 19061286U JP S6395238 U JPS6395238 U JP S6395238U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- ultrasonic bonding
- rib
- groove
- fix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
Landscapes
- Wire Bonding (AREA)
Description
第１図は本案の一実施例を示す図、第２図はＡ
―Ａ部の説明図である。
１……モールドケース、２……金属製端子、３
……フイン、４……硬度の高い接着剤、５……リ
ブ、６……溝。
Figure 1 is a diagram showing an example of the present invention, Figure 2 is A
- This is an explanatory diagram of part A. 1...Mold case, 2...Metal terminal, 3
...Fin, 4...High hardness adhesive, 5...Rib, 6...Groove.
Claims (1)
内に埋込まれた金属製端子の底部にリブを設けフ
イン側に溝を設けることにより位置固定、接着剤
塗布位置決めするとともに硬度の高い接着剤を用
いることにより超音波吸収を防止することを特徴
とする超音波ボンデイング用端子接着構造。 In ultrasonic bonding, a rib is placed on the bottom of a metal terminal embedded in a molded case, and a groove is provided on the fin side to fix the position, apply adhesive, position it, and use a highly hard adhesive to generate ultrasonic waves. A terminal adhesive structure for ultrasonic bonding that is characterized by preventing absorption.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19061286U JPS6395238U (en) | 1986-12-12 | 1986-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19061286U JPS6395238U (en) | 1986-12-12 | 1986-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6395238U true JPS6395238U (en) | 1988-06-20 |
Family
ID=31143994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19061286U Pending JPS6395238U (en) | 1986-12-12 | 1986-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6395238U (en) |
-
1986
- 1986-12-12 JP JP19061286U patent/JPS6395238U/ja active Pending