JPS6390879U - - Google Patents
Info
- Publication number
- JPS6390879U JPS6390879U JP18580486U JP18580486U JPS6390879U JP S6390879 U JPS6390879 U JP S6390879U JP 18580486 U JP18580486 U JP 18580486U JP 18580486 U JP18580486 U JP 18580486U JP S6390879 U JPS6390879 U JP S6390879U
- Authority
- JP
- Japan
- Prior art keywords
- package device
- leadless package
- circuit board
- printed circuit
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18580486U JPS6390879U (th) | 1986-12-01 | 1986-12-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18580486U JPS6390879U (th) | 1986-12-01 | 1986-12-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6390879U true JPS6390879U (th) | 1988-06-13 |
Family
ID=31134773
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18580486U Pending JPS6390879U (th) | 1986-12-01 | 1986-12-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6390879U (th) |
-
1986
- 1986-12-01 JP JP18580486U patent/JPS6390879U/ja active Pending