JPS6390852U - - Google Patents

Info

Publication number

JPS6390852U

JPS6390852U JP18643786U JP18643786U JPS6390852U JP S6390852 U JPS6390852 U JP S6390852U JP 18643786 U JP18643786 U JP 18643786U JP 18643786 U JP18643786 U JP 18643786U JP S6390852 U JPS6390852 U JP S6390852U

Authority

JP

Japan

Prior art keywords

semiconductor package

heat dissipation

printed circuit

displaced

main body

Prior art date

1986-12-03

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 15
• 230000017525 heat dissipation Effects 0.000 claims description 6
• 230000002093 peripheral effect Effects 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 2
• 230000005855 radiation Effects 0.000 description 2

Cited By (1)