JPS6390802U - - Google Patents

Info

Publication number

JPS6390802U

JPS6390802U JP18637386U JP18637386U JPS6390802U JP S6390802 U JPS6390802 U JP S6390802U JP 18637386 U JP18637386 U JP 18637386U JP 18637386 U JP18637386 U JP 18637386U JP S6390802 U JPS6390802 U JP S6390802U

Authority

JP

Japan

Prior art keywords

heat sink

resistor

lead

mounting device

circuit board

Prior art date

1986-12-03

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000005476 soldering Methods 0.000 claims description 2
• 238000010586 diagram Methods 0.000 description 1
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1

Cited By (2)