JPS6389282U - - Google Patents
Info
- Publication number
- JPS6389282U JPS6389282U JP18430186U JP18430186U JPS6389282U JP S6389282 U JPS6389282 U JP S6389282U JP 18430186 U JP18430186 U JP 18430186U JP 18430186 U JP18430186 U JP 18430186U JP S6389282 U JPS6389282 U JP S6389282U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- electronic component
- adhesive
- chip
- electrode layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18430186U JPS6389282U (it) | 1986-11-29 | 1986-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18430186U JPS6389282U (it) | 1986-11-29 | 1986-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6389282U true JPS6389282U (it) | 1988-06-10 |
Family
ID=31131846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18430186U Pending JPS6389282U (it) | 1986-11-29 | 1986-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6389282U (it) |
-
1986
- 1986-11-29 JP JP18430186U patent/JPS6389282U/ja active Pending