JPS6389278U - - Google Patents
Info
- Publication number
- JPS6389278U JPS6389278U JP18309086U JP18309086U JPS6389278U JP S6389278 U JPS6389278 U JP S6389278U JP 18309086 U JP18309086 U JP 18309086U JP 18309086 U JP18309086 U JP 18309086U JP S6389278 U JPS6389278 U JP S6389278U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- connection hole
- circuit board
- printed circuit
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Housings And Mounting Of Transformers (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18309086U JPS6389278U (es) | 1986-11-28 | 1986-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18309086U JPS6389278U (es) | 1986-11-28 | 1986-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6389278U true JPS6389278U (es) | 1988-06-10 |
Family
ID=31129501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18309086U Pending JPS6389278U (es) | 1986-11-28 | 1986-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6389278U (es) |
-
1986
- 1986-11-28 JP JP18309086U patent/JPS6389278U/ja active Pending