JPS6388981U - - Google Patents
Info
- Publication number
- JPS6388981U JPS6388981U JP18278286U JP18278286U JPS6388981U JP S6388981 U JPS6388981 U JP S6388981U JP 18278286 U JP18278286 U JP 18278286U JP 18278286 U JP18278286 U JP 18278286U JP S6388981 U JPS6388981 U JP S6388981U
- Authority
- JP
- Japan
- Prior art keywords
- molded
- base material
- containers
- bulging
- lid material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
Landscapes
- Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18278286U JPH066064Y2 (ja) | 1986-11-29 | 1986-11-29 | 成形容器の集合包装体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18278286U JPH066064Y2 (ja) | 1986-11-29 | 1986-11-29 | 成形容器の集合包装体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6388981U true JPS6388981U (de) | 1988-06-09 |
| JPH066064Y2 JPH066064Y2 (ja) | 1994-02-16 |
Family
ID=31128904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18278286U Expired - Lifetime JPH066064Y2 (ja) | 1986-11-29 | 1986-11-29 | 成形容器の集合包装体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH066064Y2 (de) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9470720B2 (en) | 2013-03-08 | 2016-10-18 | Sandisk Technologies Llc | Test system with localized heating and method of manufacture thereof |
| US9313874B2 (en) | 2013-06-19 | 2016-04-12 | SMART Storage Systems, Inc. | Electronic system with heat extraction and method of manufacture thereof |
| US9158349B2 (en) | 2013-10-04 | 2015-10-13 | Sandisk Enterprise Ip Llc | System and method for heat dissipation |
| US9549457B2 (en) | 2014-02-12 | 2017-01-17 | Sandisk Technologies Llc | System and method for redirecting airflow across an electronic assembly |
| US9497889B2 (en) | 2014-02-27 | 2016-11-15 | Sandisk Technologies Llc | Heat dissipation for substrate assemblies |
| US9348377B2 (en) | 2014-03-14 | 2016-05-24 | Sandisk Enterprise Ip Llc | Thermal isolation techniques |
| US9519319B2 (en) | 2014-03-14 | 2016-12-13 | Sandisk Technologies Llc | Self-supporting thermal tube structure for electronic assemblies |
| US9485851B2 (en) | 2014-03-14 | 2016-11-01 | Sandisk Technologies Llc | Thermal tube assembly structures |
-
1986
- 1986-11-29 JP JP18278286U patent/JPH066064Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH066064Y2 (ja) | 1994-02-16 |