JPS6388898A - Thick film circuit board - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] This invention relates to thick film circuit boards, and more particularly to the formation of intersecting conductors thereof.

[Conventional technology]

FIGS. 3 and 4 are a plan view and a cross-sectional view taken along the line A-A' of a conventional thick film circuit board, respectively. In the figures, 1 is an insulating substrate, 2 is a lower conductor that crosses 3a and 3b are a lower layer insulator, an upper layer insulator, and 4
are the intersecting top conductors.

Next, the effect will be explained. A glabellar insulator is required at the portion where the lower conductor 2 and the upper conductor 4 intersect on the surface of the insulating substrate 1. The thickness of crystallized glass is 30~
50 μm is required, and in order to prevent voids in the layer, it is common to have a two-layer structure consisting of a lower layer insulator 3a and an upper layer insulator 3b.

Further, an upper conductor 4 is formed to intersect thereon, thereby forming a conductor pattern intersection on the thick film circuit board.

[Problem that the invention seeks to solve]

Since the conventional thick film circuit board is constructed as described above, there is a large height difference between the upper layer insulator 3b and the insulating substrate 1, and if the upper conductor 4 is printed as it is, the pattern of the upper conductor 4 will be broken, There have been problems such as bleeding or blurring of the conductor paste, which may cause conductor defects and reduce printing accuracy.

This invention was made in order to solve the above-mentioned problems, and an object thereof is to provide a thick film circuit board in which the upper conductor of the intersecting conductor circuit can be formed smoothly and continuously, and with high printing precision. shall be.

[Means to solve the problem]

The thick film circuit board according to the present invention includes a second lower conductor formed on both sides of the insulator in a direction crossing the first lower conductor covered with the insulator, and a height of the second lower conductor. An intermediate conductor is further formed on the second lower conductor so as to reduce the height difference between the height of the conductor and the height of the insulator.

[Effect]

In this invention, since the second lower conductor and the intermediate conductor are provided so as to reduce the step difference between the insulating substrate and the insulator at the intersection of the conductor patterns, the step difference is reduced and the upper conductor can be formed smoothly and continuously.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure shows a thick film circuit board according to an embodiment of the present invention, and FIG.
2a is an insulating substrate, 2a is a lower conductor that intersects and is connected to the upper conductor, 2b is a lower conductor that intersects and is connected to the upper conductor, 3a is a lower layer insulator, 3b is an upper layer insulator, 4 is an upper conductor that crosses , 5 is an intermediate conductor provided on the side surface of the insulator.

Next, the effect will be explained. As described in the conventional example, an insulating layer is required between the conductors crossing each other on the insulating substrate 1, but in the present invention, the first
When forming the upper conductor 4 that intersects the lower conductor 2a, the second lower conductor 2b and the intermediate conductor 5 are formed in advance,
Thereafter, the upper conductor 4 is formed. Therefore, the level difference between the insulator 3b and the insulating substrate 1 becomes stepped due to the intermediate conductor 5 and the second lower conductor 2b.
The upper conductor 4 can be continuously formed more smoothly than when the lower conductor 2b is not formed. Moreover, since this staircase is formed of conductors such as the intermediate conductor 5 and the lower conductor 2b,
Precise printing is possible in terms of material accuracy,
The accuracy of the circuit also improves.

In the above embodiment, the intermediate conductor 5 and the lower conductor 2b have the same conductor width, but as shown in FIGS. 5 and 6, the width of the intermediate conductor 5 is set to the width of the lower conductor 2b. It may be made larger and formed to cover this.

〔Effect of the invention〕

As described above, according to the present invention, in the l\INK circuit board, the second lower conductor and the intermediate conductor are provided so as to reduce the level difference between the insulating substrate and the insulator at the intersection of the conductor patterns, Since the structure allows the upper conductor to be formed smoothly and continuously, it has the effect of providing high quality and reliability.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a thick film circuit board according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line AA', FIG. 3 is a plan view showing a conventional thick film circuit board, and FIG. 5 is a plan view showing another embodiment of the present invention, and FIG.
The figure is a cross-sectional side view taken along line AA'. 1 is an insulating substrate, 2
a is a first lower conductor, 2b is a second lower conductor, 3a is a lower layer insulator, 3b is an upper layer insulator, 4 is an upper conductor, and 5 is an intermediate conductor. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] (1) In a thick film circuit having conductor circuits that intersect on an insulating substrate, a first lower conductor formed on the insulating substrate;
a first insulator formed to cover a partial area of the lower conductor; a second insulator formed on the first insulator; and a second insulator formed on the first insulator; a second lower conductor formed on both sides of the conductor on the insulating substrate in contact with the first or both the first and second insulators; and a second lower conductor formed on the portion of the second lower conductor near the insulator. an intermediate conductor formed in contact with the second or both insulators so that the height from the insulating substrate is lower than the height of the second insulator from the insulating substrate; 1. A thick film circuit board having a conductor circuit including an upper conductor formed above the body by intersecting the first lower conductor and connecting to the intermediate conductor and the second lower conductor.