JPS6387893U - - Google Patents
Info
- Publication number
- JPS6387893U JPS6387893U JP18215386U JP18215386U JPS6387893U JP S6387893 U JPS6387893 U JP S6387893U JP 18215386 U JP18215386 U JP 18215386U JP 18215386 U JP18215386 U JP 18215386U JP S6387893 U JPS6387893 U JP S6387893U
- Authority
- JP
- Japan
- Prior art keywords
- heating elements
- cooling mechanism
- electronic equipment
- cooling
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims 4
- 238000009423 ventilation Methods 0.000 description 2
Description
第１図は本考案の一実施例の斜視図、第２図は
本考案の一実施例の平面図、第３図は通風ガイド
板の筐体への取付けを示す拡大図、第４図は従来
例の平面図である。
主要部分の符号の説明、２……通風ガイド板、
３……取付穴、７……冷却フアン。
Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a plan view of an embodiment of the invention, Fig. 3 is an enlarged view showing how the ventilation guide plate is attached to the housing, and Fig. 4 is a perspective view of an embodiment of the invention. FIG. 3 is a plan view of a conventional example. Explanation of symbols of main parts, 2... Ventilation guide plate,
3...Mounting hole, 7...Cooling fan.
Claims (1)
却用の回転体により前記電子機器内に気体を通風
させて、前記発熱体を冷却する冷却機構であつて
、前記発熱体夫々の実装状態に応じて、前記発熱
体夫々に通風される前記気体の流れを可変させる
可変手段を設けたことを特徴とする冷却機構。 A cooling mechanism that cools the heating element by ventilating gas in the electronic equipment using a cooling rotating body provided in the electronic equipment having a plurality of heating elements, the cooling mechanism depending on the mounting state of each of the heating elements. A cooling mechanism characterized in that a variable means is provided for varying the flow of the gas ventilated to each of the heating elements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18215386U JPS6387893U (en) | 1986-11-27 | 1986-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18215386U JPS6387893U (en) | 1986-11-27 | 1986-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6387893U true JPS6387893U (en) | 1988-06-08 |
Family
ID=31127685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18215386U Pending JPS6387893U (en) | 1986-11-27 | 1986-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6387893U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011103413A (en) * | 2009-11-11 | 2011-05-26 | Fujitsu Telecom Networks Ltd | Rectifying apparatus, multilayer substrate and electronic apparatus including the same, and method of cooling electronic apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55103749A (en) * | 1979-02-02 | 1980-08-08 | Hitachi Ltd | Forced air cooling type semiconductor device |
-
1986
- 1986-11-27 JP JP18215386U patent/JPS6387893U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55103749A (en) * | 1979-02-02 | 1980-08-08 | Hitachi Ltd | Forced air cooling type semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011103413A (en) * | 2009-11-11 | 2011-05-26 | Fujitsu Telecom Networks Ltd | Rectifying apparatus, multilayer substrate and electronic apparatus including the same, and method of cooling electronic apparatus |
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