JPS6387838U - - Google Patents

Info

Publication number
JPS6387838U
JPS6387838U JP18242886U JP18242886U JPS6387838U JP S6387838 U JPS6387838 U JP S6387838U JP 18242886 U JP18242886 U JP 18242886U JP 18242886 U JP18242886 U JP 18242886U JP S6387838 U JPS6387838 U JP S6387838U
Authority
JP
Japan
Prior art keywords
frame
die pad
lead frame
support member
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18242886U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18242886U priority Critical patent/JPS6387838U/ja
Publication of JPS6387838U publication Critical patent/JPS6387838U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP18242886U 1986-11-27 1986-11-27 Pending JPS6387838U (it)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18242886U JPS6387838U (it) 1986-11-27 1986-11-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18242886U JPS6387838U (it) 1986-11-27 1986-11-27

Publications (1)

Publication Number Publication Date
JPS6387838U true JPS6387838U (it) 1988-06-08

Family

ID=31128220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18242886U Pending JPS6387838U (it) 1986-11-27 1986-11-27

Country Status (1)

Country Link
JP (1) JPS6387838U (it)

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