JPS6387782U - - Google Patents

Info

Publication number

JPS6387782U

JPS6387782U JP1986182241U JP18224186U JPS6387782U JP S6387782 U JPS6387782 U JP S6387782U JP 1986182241 U JP1986182241 U JP 1986182241U JP 18224186 U JP18224186 U JP 18224186U JP S6387782 U JPS6387782 U JP S6387782U

Authority

JP

Japan

Prior art keywords

printed circuit

circuit board

copper foil

insulating

exposed end

Prior art date

1986-11-27

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
• 239000011889 copper foil Substances 0.000 claims description 4
• 230000001681 protective effect Effects 0.000 claims description 3
• 239000011810 insulating material Substances 0.000 claims 2
• 238000005476 soldering Methods 0.000 claims 2
• 239000012212 insulator Substances 0.000 claims 1
• 239000000758 substrate Substances 0.000 claims 1
• 239000000463 material Substances 0.000 description 2
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1

Cited By (2)