JPS6386114A - Magnetic disk substrate - Google Patents
Magnetic disk substrateInfo
- Publication number
- JPS6386114A JPS6386114A JP23091086A JP23091086A JPS6386114A JP S6386114 A JPS6386114 A JP S6386114A JP 23091086 A JP23091086 A JP 23091086A JP 23091086 A JP23091086 A JP 23091086A JP S6386114 A JPS6386114 A JP S6386114A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- nickel
- titanium
- magnetic disk
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 15
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 14
- 239000011521 glass Substances 0.000 claims abstract description 13
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 7
- 239000010936 titanium Substances 0.000 claims abstract description 7
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 6
- 229910000990 Ni alloy Inorganic materials 0.000 claims abstract description 5
- 239000000919 ceramic Substances 0.000 claims abstract description 5
- 229910001000 nickel titanium Inorganic materials 0.000 claims abstract 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract 2
- 239000010410 layer Substances 0.000 abstract description 12
- 239000002344 surface layer Substances 0.000 abstract description 11
- 238000007747 plating Methods 0.000 abstract description 4
- 238000005240 physical vapour deposition Methods 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 abstract description 2
- 239000005361 soda-lime glass Substances 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 12
- 238000004544 sputter deposition Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 229910001069 Ti alloy Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- WHOPEPSOPUIRQQ-UHFFFAOYSA-N oxoaluminum Chemical compound O1[Al]O[Al]1 WHOPEPSOPUIRQQ-UHFFFAOYSA-N 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
く技術分野〉
本発明は記憶媒体として用いられる磁気ディスクのため
の基板に関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a substrate for a magnetic disk used as a storage medium.
〈従来の技術〉
高密度記録用の薄膜タイプの磁気ディスクの基板は、そ
の取扱いの便宜のために十分な強度が必要であり、磁気
媒体をスパッタリングで成形する場合には温度上昇に耐
え得るような耐熱性を備え、高密度の磁気記録を可能に
しかつ磁気ヘッドの摺接に対する所要の耐摩耗性を確保
するように高い表面精度及び十分な硬度を有する必要が
ある。<Prior art> Substrates for thin-film magnetic disks for high-density recording must have sufficient strength for ease of handling, and when forming magnetic media by sputtering, they must be strong enough to withstand temperature rises. It is necessary to have high heat resistance, high surface precision, and sufficient hardness to enable high-density magnetic recording and to ensure the required wear resistance against sliding contact of the magnetic head.
従来は、第2図に示されたように、アルミ合金からなる
薄板のブランクの両面を表面研磨し、研磨された面に無
電解ニッケルめっきを行ったり、アルマイト被膜処理を
行なうことにより表面@5を形成し、更にこの表面層の
表面を研磨することにより、その表面にクロム、鉄、ニ
ッケル、コバルトなどからなる磁気膜を塗布、めっきス
パッタリングなどにより形成し、更にその表面に保護膜
を形成して磁気ディスクを完成するようにしていた。Conventionally, as shown in Fig. 2, both surfaces of a thin aluminum alloy blank are polished, and the polished surfaces are electroless nickel plated or alumite coated to improve the surface @5. By polishing the surface of this surface layer, a magnetic film made of chromium, iron, nickel, cobalt, etc. is applied to the surface, formed by plating sputtering, etc., and a protective film is further formed on the surface. He was trying to complete the magnetic disk.
しかるに、このような表面層5を良好に形成するために
は、アルミ芯板1の表面粗さがO,O’15μm程度の
高い精度を有するものであることが必要となり、特に非
金属介在物を含まない高価なアルミ合金素材を必要とし
、またアルミ合金が比較的軟質であるためにその表面加
工が困難であり、磁気ディスク基板のコストアップの原
因となっていた。また無電解ニッケルめっき層は、厚さ
が10〜20μm程度でおるために強度が必ずしも十分
でなく、また250℃付近で磁気変態を起し、そのため
に磁気膜をスパッタリングで成形する場合には基板表面
の温度上昇に伴い磁気特性の劣化を生じたり、或いはそ
のために温度上昇を抑えた特殊なスパッタリング工程が
必要となり、製造工程に多大な時間を要する原因となっ
ていた。更に、アルマイト処理を行なった場合には、十
分な強度が得られるように表面層の厚さを十分大きくし
た場合には、表面にボア等の欠陥を生じ易くなる。However, in order to form such a surface layer 5 well, it is necessary that the surface roughness of the aluminum core plate 1 has a high precision of about 0,0'15 μm, and in particular, it is necessary to prevent non-metallic inclusions. This requires an expensive aluminum alloy material that does not contain carbon dioxide, and since the aluminum alloy is relatively soft, it is difficult to process the surface of the aluminum alloy, which increases the cost of the magnetic disk substrate. Furthermore, since the electroless nickel plating layer has a thickness of about 10 to 20 μm, its strength is not necessarily sufficient, and magnetic transformation occurs at around 250°C, so when forming a magnetic film by sputtering, it is difficult to As the temperature rises on the surface, the magnetic properties may deteriorate, or a special sputtering process that suppresses the temperature rise is required, which causes the manufacturing process to take a long time. Furthermore, in the case of alumite treatment, if the thickness of the surface layer is made sufficiently large to obtain sufficient strength, defects such as bores are likely to occur on the surface.
また、研磨過程が2回必要であるために製造コストが高
騰し、製造に多大な時間が必要となる。Furthermore, since the polishing process is required twice, the manufacturing cost increases and a large amount of time is required for manufacturing.
そこで、特公昭53−37202号公報に開示されてい
るように、アルミニウムからなる芯板の表面にスパッタ
リングによりセラミックス材料の微粉末を付着させて硬
質の表面層を形成することが提案されている。しかしな
がら、表面層をスパッタリング或いは蒸着により形成す
る場合、被膜の形成に時間を要し、熱が放散するために
、被膜の厚さを約1μm以上にすることが困難である。Therefore, as disclosed in Japanese Patent Publication No. 53-37202, it has been proposed to form a hard surface layer by depositing fine powder of a ceramic material on the surface of a core plate made of aluminum by sputtering. However, when the surface layer is formed by sputtering or vapor deposition, it takes time to form the coating and heat is dissipated, making it difficult to make the coating thicker than about 1 μm.
硬質被膜が薄い場合には、磁気ディスクの強度が不十分
となり磁気ヘッドと接触した際の強度不透を生じたり磁
気ディスクを例えば床に落した場合に破損するなど取扱
い上の問題が発生し易い。If the hard coating is thin, the strength of the magnetic disk will be insufficient and handling problems may occur, such as opacity when it comes into contact with a magnetic head or damage if the magnetic disk is dropped, for example, on the floor. .
〈発明が解決しようとする問題点〉
このような従来技術の問題点に鑑み、本発明の主な目的
は、磁気ディスク基板として必要な強度、耐熱性、表面
精度及び表面硬度を有する改良された磁気ディスク用基
板を提供することにある。<Problems to be Solved by the Invention> In view of these problems of the prior art, the main object of the present invention is to provide an improved magnetic disk substrate having the strength, heat resistance, surface precision, and surface hardness necessary for the magnetic disk substrate. An object of the present invention is to provide a substrate for magnetic disks.
く問題点を解決するための手段〉
このような目的は、本発明によれば、磁気ディスク基板
であって、アルミニウムまたはアルミニウム合金からな
る芯板と、インサート材層と、ニッケル、チタン、ニッ
ケル合金またはチタン合金層と、ガラスまたはセラミッ
ク層とをこの順序にて積層してなることを特徴とする磁
気ディスク基板を提供することにより達成される。According to the present invention, such an object is to provide a magnetic disk substrate that includes a core plate made of aluminum or an aluminum alloy, an insert material layer, and a nickel, titanium, or nickel alloy. Alternatively, this can be achieved by providing a magnetic disk substrate characterized by laminating a titanium alloy layer and a glass or ceramic layer in this order.
く作用〉
このように表面硬化層としてセラミック或いはガラス層
を用いることにより、十分な強度、耐熱性、緻密性及び
硬度が得られる。特に、ニッケル、チタン或いはこれら
の合金はガラス系材料に対する付着性が良く、また圧接
過程をインサート材と芯板との間の共晶温度より高くし
かも芯板の溶融点或いは表面層の軟化点以下の温度によ
り行なうことにより、芯板とインサート材との間の接合
力を確保することができる。Effect> By using a ceramic or glass layer as the hardened surface layer in this way, sufficient strength, heat resistance, density, and hardness can be obtained. In particular, nickel, titanium, or their alloys have good adhesion to glass-based materials, and the pressure welding process can be performed at a temperature higher than the eutectic temperature between the insert material and the core plate, but below the melting point of the core plate or the softening point of the surface layer. By performing the bonding at a temperature of , it is possible to ensure the bonding force between the core plate and the insert material.
〈実施例〉
以下、本発明の好適実施例を添付の図面について詳しく
説明する。<Embodiments> Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
第1図は本発明に基づく磁気ディスク基板の断面図でお
る。まず比較的安価なアルミ合金もしくは純アルミニウ
ムからなる芯板1を準(iTるが、従来技術に基づく場
合と異なり、その表面粗さが比較的問題とならない。次
に、厚さが約50μm〜500μmのソーダ石灰ガラス
からなるガラス薄板2の片面にニッケル膜3をPVD
(物理的蒸着)或いはめつきなどにより0.5μm〜2
0μmの厚さに成膜する。薄板2は、アルミナ、ジルコ
ニア、炭化硅素、窒化硅素などのセラミックス材料或い
は石英ガラス、硼硅酸ガラスなどのガラス質材料からな
るものであって良く、ニッケル膜3は、チタン、ニッケ
ル合金またはチタン合金からなるぢのでおっても良い。FIG. 1 is a sectional view of a magnetic disk substrate according to the present invention. First, the core plate 1 is made of a relatively inexpensive aluminum alloy or pure aluminum, but unlike the case based on the conventional technology, its surface roughness is relatively not a problem. Next, the thickness is about 50 μm to A nickel film 3 is PVD deposited on one side of a glass thin plate 2 made of 500 μm soda lime glass.
(physical vapor deposition) or plating etc. to 0.5 μm to 2
A film is formed to a thickness of 0 μm. The thin plate 2 may be made of a ceramic material such as alumina, zirconia, silicon carbide, or silicon nitride, or a glass material such as quartz glass or borosilicate glass, and the nickel film 3 may be made of titanium, a nickel alloy, or a titanium alloy. It is okay to leave it as it consists of .
次に、ニッケル膜3と芯板10表面との間に0.5μm
〜1100LLの厚さのインサート材としての銅薄板4
を挟設し、548℃〜630°Cの温度にて互いに圧接
する。Next, there is a gap of 0.5 μm between the nickel film 3 and the surface of the core plate 10.
Thin copper plate 4 as insert material with a thickness of ~1100LL
are sandwiched and pressed together at a temperature of 548°C to 630°C.
このようにして得られた磁気ディスク基板は、350″
Cの温度にて磁気膜をスパッタリングする場合でも何ら
悪影響を受けることがない。また、400’Cに加熱し
てこれを水中に没入させる急冷過程を5サイクル繰返し
ても、割れや変形などの異常を生じることがなかった。The magnetic disk substrate thus obtained has a diameter of 350″
Even when the magnetic film is sputtered at a temperature of C, there is no adverse effect. Moreover, even after repeating the rapid cooling process of heating to 400'C and immersing it in water for 5 cycles, no abnormalities such as cracking or deformation occurred.
また、ガラス薄板2の面取りを行なったサンプルについ
て、約1メートルの高さから塩化ビニールタイル上に落
した場合にも破損や割れが生じなかった。また、このよ
うなサンプルにより割れ試験を行なった所、ガラス層の
割れが発生した場合でも、接合面が剥離することがなく
、十分な接合強度が得られていることが見出された。Furthermore, when the thin glass plate 2 was chamfered and dropped onto a vinyl chloride tile from a height of about 1 meter, no damage or cracks occurred. Furthermore, when a cracking test was conducted using such a sample, it was found that even if the glass layer cracked, the bonded surface did not peel off, and sufficient bonding strength was obtained.
インサート材としては銅が好適であるが、銅はガラスに
対する付着性が良くない。しかしながら、ニッケル、チ
タンなどはガラスに対する付着性が良い。インサート材
を用いない場合には、アルミニウム製の芯板1の表面に
Al2O2膜が形成され、ニッケル膜3との間の接合力
が問題となるが、銅薄板4からなるインサート材を用い
、しかも銅とアルミニウムとの間の共晶温度以上の温度
により圧接を行なうため、十分な接合力が得られる。Copper is suitable as the insert material, but copper has poor adhesion to glass. However, nickel, titanium, etc. have good adhesion to glass. If an insert material is not used, an Al2O2 film is formed on the surface of the aluminum core plate 1, and the bonding strength with the nickel film 3 becomes a problem. Since the pressure bonding is performed at a temperature above the eutectic temperature between copper and aluminum, sufficient bonding strength can be obtained.
〈発明の効果〉 本発明の効果は以下の通りである。<Effect of the invention> The effects of the present invention are as follows.
0表面層が非磁性で硬質な材質からなり、その厚さも任
意に調節可能であるため、強度が高く緻密な表面層を得
ることができる。Since the surface layer is made of a non-magnetic and hard material and its thickness can be arbitrarily adjusted, a high-strength and dense surface layer can be obtained.
0表面の特性は接合された硬質層により得られるため、
芯板として用いられアルミ合金は安価な一般材で良くコ
スト低下が図れる。Since the properties of the 0 surface are obtained by the bonded hard layer,
The aluminum alloy used as the core plate is an inexpensive general material and can reduce costs.
■接合前の芯板の表面粗さの影響は少なく、研磨が困難
なアルミ合金の表面研磨が必要なくなり、同じくコスト
低下が図れる。■The surface roughness of the core plate before bonding has little effect, eliminating the need for surface polishing of the aluminum alloy, which is difficult to polish, and reducing costs as well.
■接合方法を300℃以上の耐熱性のある方法(蝋付け
、拡散接合など)とすれば、磁気膜をスパッタリング法
により効率的に成膜することができ、磁気特性の向上と
生産性の向上が図れる。■If the bonding method is a heat-resistant method of 300℃ or higher (brazing, diffusion bonding, etc.), the magnetic film can be efficiently formed by sputtering, improving magnetic properties and productivity. can be achieved.
第1図は本発明に基づく磁気ディスク基板の断面図であ
る。
第2図は従来形式の磁気ディスク基板の断面図である。
1・・・芯板 2・・・ガラス薄板3・・・
ニッケル膜 4・・・銅薄板5・・・表面層FIG. 1 is a sectional view of a magnetic disk substrate according to the present invention. FIG. 2 is a sectional view of a conventional magnetic disk substrate. 1...Core plate 2...Thin glass plate 3...
Nickel film 4... Copper thin plate 5... Surface layer
Claims (2)
、 ガラスまたはセラミック層とをこの順序にて積層してな
ることを特徴とする磁気ディスク基板。(1) A magnetic disk substrate, in which a core plate made of aluminum or aluminum alloy, an insert material layer, a nickel, titanium, nickel alloy or titanium alloy layer, and a glass or ceramic layer are laminated in this order. A magnetic disk substrate characterized by:
を特徴とする特許請求の範囲第1項に記載の磁気ディス
ク基板。(2) The magnetic disk substrate according to claim 1, wherein the insert material is made of copper or a copper alloy.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23091086A JPH0626011B2 (en) | 1986-09-29 | 1986-09-29 | Magnetic disk substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23091086A JPH0626011B2 (en) | 1986-09-29 | 1986-09-29 | Magnetic disk substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6386114A true JPS6386114A (en) | 1988-04-16 |
JPH0626011B2 JPH0626011B2 (en) | 1994-04-06 |
Family
ID=16915198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23091086A Expired - Lifetime JPH0626011B2 (en) | 1986-09-29 | 1986-09-29 | Magnetic disk substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0626011B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998058367A1 (en) * | 1997-06-18 | 1998-12-23 | The Dow Chemical Company | A multilayer hard drive disk and method to produce same |
-
1986
- 1986-09-29 JP JP23091086A patent/JPH0626011B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998058367A1 (en) * | 1997-06-18 | 1998-12-23 | The Dow Chemical Company | A multilayer hard drive disk and method to produce same |
Also Published As
Publication number | Publication date |
---|---|
JPH0626011B2 (en) | 1994-04-06 |
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