JPS6384953U

JPS6384953U -

Info

Publication number: JPS6384953U
Application number: JP17944886U
Authority: JP
Priority date: 1986-11-20
Filing date: 1986-11-20
Publication date: 1988-06-03

Description

[Brief explanation of the drawing]

第１図は第２図の―断面図、第２図は本考
案に係る静電チヤツクを示す平面図、第３図は従
来の静電チヤツクを示す平面図、第４図は第３図
の―断面図である。１……絶縁台、３，４……静電電極、５……絶
縁層、６……半導体ウエハ、７……直流電源、８
……常開接点、１６……ロツド、１８……フツク
、１９……爪部、２０……スプリング。 Fig. 1 is a sectional view of Fig. 2, Fig. 2 is a plan view showing the electrostatic chuck according to the present invention, Fig. 3 is a plan view showing the conventional electrostatic chuck, and Fig. 4 is the same as Fig. 3. -This is a cross-sectional view. 1... Insulating stand, 3, 4... Electrostatic electrode, 5... Insulating layer, 6... Semiconductor wafer, 7... DC power supply, 8
... Normally open contact, 16 ... Rod, 18 ... Hook, 19 ... Claw, 20 ... Spring.

補正昭６２．５．９実用新案登録請求の範囲を次のように補正する
。Amendment May 9, 1982 The scope of claims for utility model registration is amended as follows.

【実用新案登録請求の範囲】絶縁台に設けられその表面上に絶縁層を介して
半導体ウエハを吸着可能な静電電極を備えた静電
チヤツクにおいて、前記絶縁台に半導体ウエハの
裏側でソレノイドコイルとスプリングによつて径
方向に進退するロツドを設けると共に、このロツ
ドの進退動作によつて回動するフツクを設け、こ
のフツクの一端には半導体ウエハの周縁を係脱す
る爪部が設けられ、この爪部は、前記スプリング
によつて半導体ウエハを係止可能に構成され、か
つ前記ソレノイドコイルによつて半導体ウエハを
離脱可能に構成されていることを特徴とする静電
チヤツク。図面の簡単な説明を次のように補正する。明細書８頁１行の「常開接点、」の次に「１５
……ソレノイドコイル、」を挿入する。[Claims for Utility Model Registration] An electrostatic chuck is provided with an electrostatic electrode that is provided on an insulating stand and is capable of adsorbing a semiconductor wafer on its surface through an insulating layer, wherein a solenoid coil is mounted on the insulating stand on the back side of the semiconductor wafer. A rod is provided that moves forward and backward in the radial direction using a spring , and a hook that rotates as the rod moves forward and backward is provided, and one end of this hook has a claw that engages and disengages the peripheral edge of the semiconductor wafer. An electrostatic chuck characterized in that the nail portion is configured to be capable of locking a semiconductor wafer by the spring and configured to be capable of detaching the semiconductor wafer by the solenoid coil. . The brief description of the drawing has been amended as follows. On page 8 of the specification, line 1, “Normally open contact” is followed by “15
...Insert the solenoid coil.

Claims

[Scope of utility model registration request]

In an electrostatic chuck equipped with an electrostatic electrode provided on an insulating stand and capable of adsorbing a semiconductor wafer on its surface through an insulating layer, the insulating stand is provided with a rod that advances and retreats in the radial direction on the back side of the semiconductor wafer, and
A hook is provided that rotates as the rod advances and retreats, and one end of this hook is provided with a claw portion that locks the periphery of the semiconductor wafer, and the other end is provided with a hook that allows the elastic force of a spring to be applied via the rod. An electrostatic chuck characterized in that it is energized.