JPS6382524U - - Google Patents
Info
- Publication number
- JPS6382524U JPS6382524U JP17740386U JP17740386U JPS6382524U JP S6382524 U JPS6382524 U JP S6382524U JP 17740386 U JP17740386 U JP 17740386U JP 17740386 U JP17740386 U JP 17740386U JP S6382524 U JPS6382524 U JP S6382524U
- Authority
- JP
- Japan
- Prior art keywords
- molded product
- circuit pattern
- thermoplastic resin
- resin molded
- concave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005992 thermoplastic resin Polymers 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Description
第１図ａは金型の断面図、第１図ｂは第１図ａ
の部分拡大図、第２図ａは回路付成形品の断面図
、第２図ｂは第２図ａの部分拡大図、第３図はキ
ヤビテイ側およびコア側に凸部を設けた金型の断
面図、第４図ａは第３図の金型を用いて成形した
成形品の断面図、第４図ｂは第４図ａの部分拡大
図である。
符号の説明、１……金型コア、１′……金型キ
ヤビテイ、２……凸部、３……梨地、４……凹状
回路パターン、５……銅ペースト、６……凸部、
７……ツキピン、８……両面凹状回路パターン、
９……導通部（スルホール）。
Figure 1a is a cross-sectional view of the mold, Figure 1b is Figure 1a
FIG. 2a is a cross-sectional view of the molded product with circuit, FIG. 4a is a sectional view of a molded product molded using the mold shown in FIG. 3, and FIG. 4b is a partially enlarged view of FIG. 4a. Explanation of symbols, 1... Mold core, 1'... Mold cavity, 2... Convex portion, 3... Satin finish, 4... Concave circuit pattern, 5... Copper paste, 6... Convex portion,
7... Tsuki pin, 8... Double-sided concave circuit pattern,
9...Conducting part (through hole).
Claims (1)
ンを設け、この凹状回路パターンの溝部に導電性
組成物よりなる樹脂ペーストを注入し硬化させ、
導電性回路を形成したことを特徴とする熱可塑性
樹脂成形品。 In a thermoplastic resin molded product, a concave circuit pattern is provided, and a resin paste made of a conductive composition is injected into the grooves of the concave circuit pattern and cured.
A thermoplastic resin molded product characterized by forming a conductive circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17740386U JPS6382524U (en) | 1986-11-18 | 1986-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17740386U JPS6382524U (en) | 1986-11-18 | 1986-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6382524U true JPS6382524U (en) | 1988-05-31 |
Family
ID=31118571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17740386U Pending JPS6382524U (en) | 1986-11-18 | 1986-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6382524U (en) |
-
1986
- 1986-11-18 JP JP17740386U patent/JPS6382524U/ja active Pending
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