JPS638139B2 - - Google Patents
Info
- Publication number
- JPS638139B2 JPS638139B2 JP12457479A JP12457479A JPS638139B2 JP S638139 B2 JPS638139 B2 JP S638139B2 JP 12457479 A JP12457479 A JP 12457479A JP 12457479 A JP12457479 A JP 12457479A JP S638139 B2 JPS638139 B2 JP S638139B2
- Authority
- JP
- Japan
- Prior art keywords
- polyamide
- polyphenylene oxide
- resin
- present
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004952 Polyamide Substances 0.000 claims description 23
- 229920002647 polyamide Polymers 0.000 claims description 23
- 150000001875 compounds Chemical class 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 238000006116 polymerization reaction Methods 0.000 claims description 4
- 239000011342 resin composition Substances 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 125000000466 oxiranyl group Chemical group 0.000 claims description 3
- 125000005843 halogen group Chemical group 0.000 claims description 2
- 150000002430 hydrocarbons Chemical class 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 150000002431 hydrogen Chemical class 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 18
- 229920006380 polyphenylene oxide Polymers 0.000 description 18
- -1 phenol compound Chemical class 0.000 description 14
- 239000000047 product Substances 0.000 description 11
- 238000004898 kneading Methods 0.000 description 9
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 229920001778 nylon Polymers 0.000 description 7
- 239000004677 Nylon Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 3
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 3
- 150000003512 tertiary amines Chemical class 0.000 description 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- CIRRFAQIWQFQSS-UHFFFAOYSA-N 6-ethyl-o-cresol Chemical compound CCC1=CC=CC(C)=C1O CIRRFAQIWQFQSS-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 229920001207 Noryl Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 150000002696 manganese Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920002852 poly(2,6-dimethyl-1,4-phenylene oxide) polymer Polymers 0.000 description 2
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- XRUGBBIQLIVCSI-UHFFFAOYSA-N 2,3,4-trimethylphenol Chemical compound CC1=CC=C(O)C(C)=C1C XRUGBBIQLIVCSI-UHFFFAOYSA-N 0.000 description 1
- METWAQRCMRWDAW-UHFFFAOYSA-N 2,6-diethylphenol Chemical compound CCC1=CC=CC(CC)=C1O METWAQRCMRWDAW-UHFFFAOYSA-N 0.000 description 1
- ATGFTMUSEPZNJD-UHFFFAOYSA-N 2,6-diphenylphenol Chemical compound OC1=C(C=2C=CC=CC=2)C=CC=C1C1=CC=CC=C1 ATGFTMUSEPZNJD-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- CUFXMPWHOWYNSO-UHFFFAOYSA-N 2-[(4-methylphenoxy)methyl]oxirane Chemical compound C1=CC(C)=CC=C1OCC1OC1 CUFXMPWHOWYNSO-UHFFFAOYSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- PGJXFACHLLIKFG-UHFFFAOYSA-N 2-methyl-6-phenylphenol Chemical compound CC1=CC=CC(C=2C=CC=CC=2)=C1O PGJXFACHLLIKFG-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- BDBZTOMUANOKRT-UHFFFAOYSA-N 4-[2-(4-aminocyclohexyl)propan-2-yl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1C(C)(C)C1CCC(N)CC1 BDBZTOMUANOKRT-UHFFFAOYSA-N 0.000 description 1
- OSDLLIBGSJNGJE-UHFFFAOYSA-N 4-chloro-3,5-dimethylphenol Chemical compound CC1=CC(O)=CC(C)=C1Cl OSDLLIBGSJNGJE-UHFFFAOYSA-N 0.000 description 1
- JDCCCHBBXRQRGU-UHFFFAOYSA-N 5-phenylpenta-2,4-dienenitrile Chemical class N#CC=CC=CC1=CC=CC=C1 JDCCCHBBXRQRGU-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910021380 Manganese Chloride Inorganic materials 0.000 description 1
- GLFNIEUTAYBVOC-UHFFFAOYSA-L Manganese chloride Chemical compound Cl[Mn]Cl GLFNIEUTAYBVOC-UHFFFAOYSA-L 0.000 description 1
- 229920001890 Novodur Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- YFTIRLAWDTWKKG-UHFFFAOYSA-K [Na+].[Cl-].[Mn+2].[Cl-].[Cl-] Chemical compound [Na+].[Cl-].[Mn+2].[Cl-].[Cl-] YFTIRLAWDTWKKG-UHFFFAOYSA-K 0.000 description 1
- BIYKEPBSFZMLOB-UHFFFAOYSA-K [OH-].[K+].[Cu+2].[OH-].[OH-] Chemical class [OH-].[K+].[Cu+2].[OH-].[OH-] BIYKEPBSFZMLOB-UHFFFAOYSA-K 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 125000002603 chloroethyl group Chemical group [H]C([*])([H])C([H])([H])Cl 0.000 description 1
- 125000000068 chlorophenyl group Chemical group 0.000 description 1
- 150000001868 cobalt Chemical class 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000011437 continuous method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- MIHINWMALJZIBX-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ol Chemical class OC1CC=CC=C1 MIHINWMALJZIBX-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 239000011565 manganese chloride Substances 0.000 description 1
- 229940099607 manganese chloride Drugs 0.000 description 1
- 235000002867 manganese chloride Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 1
- 238000005691 oxidative coupling reaction Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 150000004707 phenolate Chemical class 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- AOJFQRQNPXYVLM-UHFFFAOYSA-N pyridin-1-ium;chloride Chemical compound [Cl-].C1=CC=[NH+]C=C1 AOJFQRQNPXYVLM-UHFFFAOYSA-N 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N pyridine Substances C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229930000044 secondary metabolite Natural products 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- WQDUMFSSJAZKTM-UHFFFAOYSA-N sodium methoxide Substances [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 1
- NESLWCLHZZISNB-UHFFFAOYSA-M sodium phenolate Chemical compound [Na+].[O-]C1=CC=CC=C1 NESLWCLHZZISNB-UHFFFAOYSA-M 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- AVBGNFCMKJOFIN-UHFFFAOYSA-N triethylammonium acetate Chemical compound CC(O)=O.CCN(CC)CC AVBGNFCMKJOFIN-UHFFFAOYSA-N 0.000 description 1
- SZYJELPVAFJOGJ-UHFFFAOYSA-N trimethylamine hydrochloride Chemical compound Cl.CN(C)C SZYJELPVAFJOGJ-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 239000011345 viscous material Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Epoxy Resins (AREA)
Description
本発明は、ポリフエニレンオキシドとポリアミ
ドと特定の構造を有する化合物からなる樹脂組成
物に関するものである。
ポリフエニレンオキシド樹脂は熱的性質、機械
的性質、電気的性質などに優れた樹脂であり、商
業的には、ポリスチレン系樹脂とブレンドしノリ
ル樹脂としてゼネラル・エレクトリツク社より製
造、市販されている。ポリフエニレンオキシド樹
脂ならびにその変性物であるノリル樹脂の欠点と
しては、耐溶剤性が劣ることにあり、他は優れた
諸特性を有しているいもかかわらず、ある種の用
途には、その使用が制限されているのが現状であ
り、その改良が強く望まれている。
本発明者は、ポリフエニレンオキシド樹脂の諸
特性を、大きく損うことなく、耐溶剤性の優れた
樹脂の開発を鋭意研究した結果、先にポリフエニ
レンオキシドとポリアミドを特定の割合で、溶融
混練することにより、耐容剤性の優れた材料を提
供できることを見出し特許出願を行つた。
その方法によつて製造された樹脂組成物は、成
形加工時における相分離もなく、耐溶剤性に優れ
た性質を示すが、耐衝撃性の点で、今一歩、不充
分である。この点を改良すべく、更に研究を続け
たところ、ポリフエニレンオキシドとポリアミド
に特定の構造を有する化合物を加え、溶融混練し
たものが、ポリフエニレンオキシドとポリアミド
だけの溶融混練物に比し、耐衝撃性などの機械的
強度の優れた材料が得られることを見出した。
本発明に従つて、得られた組成物が、ポリフエ
ニレンオキシドとポリアミドだけの溶融混練物に
比し、機械的強度が、優れる理由は明確ではない
が、両者の電子顕微鏡写真撮影からみて、本発明
の組成物は、ポリフエニレンオキシドとポリアミ
ドとの間に、グラフト反応が起こつたものではな
いかと推定される。
すなわち、ポリフエニレンオキシドとポリアミ
ドのみを溶融混練したものに比べ、本発明による
ところの方法によつて得られたものは、ポリフエ
ニレンオキシド部分とポリアミド部分とが著しく
微細に分散しているのが認められる。
本発明は、ポリフエニレンオキシドとポリアミ
ドに更に、特定の構造を有する化合物、すなわち
分子内にオキシラン環を有する化合物および/又
は、二価フエノールとエピクロロヒドリンとの縮
合高分子量体を添加し、溶融混練することによ
り、得られる耐衝撃性などの機械的強度の優れた
樹脂組成物に関するものである。
本発明におけるポリフエニレンオキシド樹脂と
は、一般式
(式中、R1,R2,R3,R4,R5は水素、ハロゲ
ン原子、炭化水素基もしくは置換炭化水素基から
選ばれたものであり、そのうち必らず1個は水素
原子である。)
で示されるフエノール化合物を酸化カツプリング
触媒を用い酸素又は酸素含有ガスで酸化重合せし
めて得られる重合体である。
上記一般式におけるR1,R2,R3,R4,R5の具
体例としては、水素、塩素、フツ素、臭素、ヨウ
素、メチル、エチル、プロピル、ブチル、クロロ
エチル、ヒドロキシエチル、フエニルエチル、ベ
ンジル、ビドロキシメチル、カルボキシエチル、
メトキシカルボニルエチル、シアノエチル、フエ
ニル、クロロフエニル、メチルフエニル、ジメチ
ルフエニル、エチルフエニルなどが挙げられる。
上記一般式の具体例としては、フエノール、
0,m又はp―クレゾール、2,6―、2,5
―、2,4―又は3,5―ジメチルフエノール、
2―メチル―6―フエニル―フエノール、2,6
―ジフエニルフエノール、2,6―ジエチルフエ
ノール、2―メチル―6―エチルフエノール、
2,3,5―、2,3,6―および2,4,6―
トリメチルフエノールなどが挙げられる。これら
のフエノール化合物は2種以上用いることもよ
い。
フエノール化合物を酸化重合せしめる際に用い
られる酸化カツプリング触媒は、特に限定される
ものではなく、重合能を有するいかなる触媒でも
使用し得る。たとえば、その代表的なものとして
は、塩化第1銅―トリメチルアミン、酢酸第1銅
―トリエチルアミン、塩化第1銅―ピリジンな
ど、第1銅塩と第3級アミン類より成る触媒、塩
化第2銅―ピリジン―水酸化カリウムなどの第2
銅塩―第3級アミンおよびアルカリ金属水酸化物
より成る触媒、塩化マンガン―エタノールアミ
ン、酢酸マンガン―エチレンジアミドなどのマン
ガン塩類と第1級アミン類よりなる触媒、塩化マ
ンガン―ナトリウムメチラート、塩化マンガン―
ナトリウムフエノラートなどのマンガン塩類とア
ルコラートあるいはフエノーラートからなる触
媒、コバルト塩類と第3級アミン類との組合せよ
りなる触媒などがあげられる。
本発明において用いられるポリアミドは、ポリ
マー主鎖に
The present invention relates to a resin composition comprising polyphenylene oxide, polyamide, and a compound having a specific structure. Polyphenylene oxide resin is a resin with excellent thermal, mechanical, and electrical properties, and commercially, it is blended with polystyrene resin and manufactured and sold as Noryl resin by General Electric Company. There is. The disadvantage of polyphenylene oxide resin and its modified product, noryl resin, is that it has poor solvent resistance, and although it has other excellent properties, it is difficult to use it for certain applications. Currently, its use is limited, and its improvement is strongly desired. As a result of intensive research into the development of a resin with excellent solvent resistance without significantly impairing the various properties of polyphenylene oxide resin, the inventor first discovered that polyphenylene oxide and polyamide were mixed in a specific ratio. They discovered that a material with excellent tolerability could be provided by melt-kneading, and filed a patent application. Although the resin composition produced by this method exhibits excellent solvent resistance without phase separation during molding, it is still insufficient in terms of impact resistance. In order to improve this point, we continued our research and found that a product obtained by adding a compound with a specific structure to polyphenylene oxide and polyamide and melt-kneading it was compared to a melt-kneaded product of only polyphenylene oxide and polyamide. It was discovered that a material with excellent mechanical strength such as impact resistance can be obtained. Although it is not clear why the composition obtained according to the present invention has better mechanical strength than a melt-kneaded product of only polyphenylene oxide and polyamide, it is clear from the electron micrographs of both of them that It is presumed that in the composition of the present invention, a graft reaction occurs between polyphenylene oxide and polyamide. That is, compared to a product obtained by melt-kneading only polyphenylene oxide and polyamide, the product obtained by the method according to the present invention has a significantly finer distribution of polyphenylene oxide and polyamide parts. is recognized. In the present invention, a compound having a specific structure, that is, a compound having an oxirane ring in the molecule and/or a condensed polymer of dihydric phenol and epichlorohydrin is added to polyphenylene oxide and polyamide. This invention relates to a resin composition having excellent mechanical strength such as impact resistance, which can be obtained by melt-kneading. The polyphenylene oxide resin in the present invention has the general formula (In the formula, R 1 , R 2 , R 3 , R 4 , and R 5 are selected from hydrogen, halogen atoms, hydrocarbon groups, or substituted hydrocarbon groups, and one of them is necessarily a hydrogen atom. It is a polymer obtained by oxidative polymerization of the phenol compound shown in Specific examples of R 1 , R 2 , R 3 , R 4 , and R 5 in the above general formula include hydrogen, chlorine, fluorine, bromine, iodine, methyl, ethyl, propyl, butyl, chloroethyl, hydroxyethyl, phenylethyl, benzyl, bidroxymethyl, carboxyethyl,
Examples include methoxycarbonylethyl, cyanoethyl, phenyl, chlorophenyl, methylphenyl, dimethylphenyl, and ethylphenyl. Specific examples of the above general formula include phenol,
0,m or p-cresol, 2,6-,2,5
-, 2,4- or 3,5-dimethylphenol,
2-methyl-6-phenyl-phenol, 2,6
-diphenylphenol, 2,6-diethylphenol, 2-methyl-6-ethylphenol,
2,3,5-, 2,3,6- and 2,4,6-
Examples include trimethylphenol. Two or more types of these phenol compounds may be used. The oxidative coupling catalyst used in oxidative polymerization of the phenol compound is not particularly limited, and any catalyst having polymerization ability may be used. For example, typical examples include catalysts consisting of cuprous salts and tertiary amines, such as cuprous chloride-trimethylamine, cuprous acetate-triethylamine, cuprous chloride-pyridine, etc. - Pyridine - Secondary compounds such as potassium hydroxide
Copper salts - catalysts consisting of tertiary amines and alkali metal hydroxides, manganese chloride - catalysts consisting of manganese salts and primary amines such as ethanolamine, manganese acetate - ethylenediamide, manganese chloride - sodium methylate, chloride manganese-
Examples include catalysts consisting of manganese salts such as sodium phenolate and alcoholates or phenolates, and catalysts consisting of a combination of cobalt salts and tertiary amines. The polyamide used in the present invention has a
【式】結合を有するものであ
つて、加熱溶融できるものであれば、いずれも可
能である。
その代表的なものとしては、4―ナイロン、6
―ナイロン、6,6―ナイロン、12―ナイロン、
6,10―ナイロン、テレフタル酸とトリメチルヘ
キサメチレンジアミンからのポリアミド、アジピ
ン酸とメタキシリレンジアミンからのポリアミ
ド、アジピン酸とアゼライン酸および2,2―ビ
ス(p―アミノシクロヘキシル)―プロパンから
のポリアミド、テレフタル酸と4,4′―ジアミ
ノシシクロヘキシルメタンからのポリアミドなど
が挙げられる。
ポリフエニレンオキシドとポリアミドの混合比
率は、ポリフエニレンオキシド5〜95wt%、ポ
リアミド95〜5wt%が適当である。ポリアミドが
5wt%より少ない範囲では、耐溶剤性の改良効果
が少さく、ポリアミドが95wt%を越える範囲で
は熱変形温度などの熱的性質が劣る傾向を示すの
で、好ましくない。
本発明におけるオキシラン環を有する化合物の
具体例としては、多価フエノール類とエピクロル
ヒドリンとを各種の割合で縮合させたもので、そ
の代表例としては、たとえば、ビスフエノールA
とエピクロルヒドリンとの縮合物、(商品として
は、たとえば、住友化学工業(株)のスミエポキシ
ELA―115、ELA―127、ELA―128、ELA―
134、ESA―011、ESA―014、ESA―017、ESA
―019など)、レゾルシンとエピクロルヒドリンと
の縮合物、ハイドロキノンとエピクロロヒドリン
との縮合物、テトラブロモビスフエノールAとエ
ピクロロヒドリンとの縮合物、フエノールノボラ
ツク又はクレゾールノボラツクをクリシジルエー
テル化したもの(例えば、住友化学工業(株)のスミ
エポキシESCN―220シリーズなど)などが挙げ
られる。
多価アルコールとエピクロロヒドリンとの縮合
物、その多価アルコールの代表例としては、エチ
レングリコール、プロピレングリコール、ブチレ
ングリコール、ポリエチレングリコール、ポリプ
ロピレングリコール、グリセリン、トリメチロー
ルエタン、トリメチロールプロパン、ベンタエリ
スリトールなどが挙げられる。
1価フエノール又は一価アルコールのグリシジ
ルエーテル化物、たとえば、フエニルグリシジル
エーテル、ブチルグリシジルエーテル、クレジル
クリシジルエーテルなどが挙げられる。
アミン化合物のグリシジル化物(商品として
は、たとえば、住友化学工業(株)より市販されてい
るアニリンのジクリシジル化物であるスミエポキ
シELN―125)、高級オレフインのエポキシ化物、
シクロアルケンのエポキシ化物などが挙げられ
る。
本発明における二価フエノールとエピクロロヒ
ドリンとの縮合高分子量体の商品として容易に入
手できるのは、フエノキシ樹脂とよばれるもの
が、その打表的なものである。
本発明における特定化合物は2種以上用いるこ
とも可能である。
本発明における特定化合物の添加量としては、
ポリフエニレンオキシドおよびポリアミドの混合
物100重量部に対して、
本発明の組成物を製造する方法に、特に限定は
なく、通常の公知の方法が採用される。一般に
は、溶融混練する方法が好ましい。
溶融混練する温度ならびに時間には、特に限定
はない。温度としては、ポリフエニレンオキシド
とポリアミドの組成比などによつても若干変る
が、一般には150〜350℃の範囲がとられる。溶融
混練する装置としては、溶融粘性体を取扱い得る
方法であれば如何なる方法によつてもよく、バツ
チ方式、連続方式のいずれの方法も使用できる。
その具体例例としては、たとえば、押出機、バン
バリーミキサー、ロール、ニーダーなどが挙げら
れる。
本発明を実施するに際し、他のポリマー、ガラ
ス繊維、カーボン繊維、カーボンブラツク、シリ
カ、TiO2等の充填剤、可塑剤、難燃剤、顔料な
どを添加することも可能である。
特に、耐衝撃強度を向上させるために、ゴム状
重合体、ゴム変性スチレン系樹脂、加工性をより
改良するために、スチレン系重合体の添加は望ま
しい。ゴム状重合体の具体例としてはポリブタジ
エン、ブタジエン―スチレン共重合体、エチレン
―プロピレン共重合体、エチレン―プロピレン―
ジエン共重合体、ポリイソプレン、ポリイソブチ
レン、ポリアクリル酸エステル、ポリエステル、
ポリウレタンおよびこれらの各種変性重合体など
が挙げられる。
ゴム変性スチレン系樹脂の具体例としては、た
とえば、ブタジエン系ゴム変性ポリスチレン、ブ
タジエン系ゴム変性スチレン―アクリロニトリル
共重合体、アクリルゴム変性ポリスチレン、アク
リルゴム変性スチレン―アクリロニトリル共重合
体、エチレン―プロピレン共重合体変性ポリスチ
レン、エチレン―メチルメタクリレート共重合体
変性ポリスチレンなどが挙げられる。
以下、本発明の方法を実施例により詳細に説明
するが、本発明はこれらに限定されるものではな
い。
実施例 1〜7
2,6―ジメチルフエノールをトルエンおよび
メタノールに溶かし、塩化マンガン―エチレンジ
アミンを添加、酸素ふん囲気下で、酸化すること
によつて得られたポリー(2,6―ジメチル―
1,4―フエニレンオキシド)(クロロホルム中
で測定の固有粘度0.55d/g)およびナイロン
―6,6(東レ(株)製)を用い、第1表の特定化合
物を添加し、250〜300℃の範囲で、5分間混練し
た。混練装置はブラベンダープラストグラフを用
いた。
機械的強度を示すためIzod衝撃値を耐熱性を知
る目的で熱変形温度(HDT)をそれぞれ測定し
た。
その結果を第1表に示す。
比較例 1
実施例1で用いたポリフエニレンオキシドおよ
びポリアミドを用い、特定化合物を添加しないで
溶融混練した結果を比較例1として第1表に示し
た。[Formula] Anything is possible as long as it has a bond and can be melted by heating. Typical examples include 4-nylon, 6-nylon,
-Nylon, 6,6-nylon, 12-nylon,
6,10-nylon, polyamides from terephthalic acid and trimethylhexamethylene diamine, polyamides from adipic acid and metaxylylene diamine, polyamides from adipic acid, azelaic acid and 2,2-bis(p-aminocyclohexyl)-propane. , polyamides made from terephthalic acid and 4,4'-diaminocyclohexylmethane, and the like. A suitable mixing ratio of polyphenylene oxide and polyamide is 5 to 95 wt% of polyphenylene oxide and 95 to 5 wt% of polyamide. polyamide
If the polyamide content is less than 5 wt%, the effect of improving solvent resistance is small, and if the polyamide content exceeds 95 wt%, thermal properties such as heat distortion temperature tend to be poor, which is not preferable. Specific examples of the compound having an oxirane ring in the present invention include compounds obtained by condensing polyhydric phenols and epichlorohydrin in various proportions, such as bisphenol A.
and epichlorohydrin (products include, for example, Sumiepoxy from Sumitomo Chemical Co., Ltd.)
ELA-115, ELA-127, ELA-128, ELA-
134, ESA-011, ESA-014, ESA-017, ESA
-019, etc.), condensates of resorcinol and epichlorohydrin, condensates of hydroquinone and epichlorohydrin, condensates of tetrabromobisphenol A and epichlorohydrin, phenol novolak or cresol novolak with chrycidyl ether (for example, Sumiepoxy ESCN-220 series by Sumitomo Chemical Co., Ltd.). Condensation products of polyhydric alcohols and epichlorohydrin. Typical examples of polyhydric alcohols include ethylene glycol, propylene glycol, butylene glycol, polyethylene glycol, polypropylene glycol, glycerin, trimethylolethane, trimethylolpropane, and bentaerythritol. Examples include. Glycidyl ethers of monohydric phenols or monohydric alcohols, such as phenyl glycidyl ether, butyl glycidyl ether, cresyl glycidyl ether, and the like. Glycidylated amine compounds (for example, Sumiepoxy ELN-125, which is a diclycidylated aniline commercially available from Sumitomo Chemical Co., Ltd.), epoxidized products of higher olefins,
Examples include epoxidized products of cycloalkenes. The most commonly available product of the condensed polymer of dihydric phenol and epichlorohydrin used in the present invention is called phenoxy resin. It is also possible to use two or more kinds of specific compounds in the present invention. The amount of the specific compound added in the present invention is as follows:
There is no particular limitation on the method for producing the composition of the present invention based on 100 parts by weight of the mixture of polyphenylene oxide and polyamide, and any conventional known method may be employed. Generally, a method of melting and kneading is preferred. There are no particular limitations on the temperature and time for melt-kneading. Although the temperature varies slightly depending on the composition ratio of polyphenylene oxide and polyamide, it is generally in the range of 150 to 350°C. The apparatus for melt-kneading may be any method as long as it can handle a molten viscous material, and either a batch method or a continuous method can be used.
Specific examples include an extruder, a Banbury mixer, a roll, a kneader, and the like. In carrying out the present invention, it is also possible to add other polymers, fillers such as glass fiber, carbon fiber, carbon black, silica, TiO2 , plasticizers, flame retardants, pigments, etc. In particular, it is desirable to add a rubbery polymer, a rubber-modified styrenic resin, and a styrenic polymer to further improve processability in order to improve impact strength. Specific examples of rubbery polymers include polybutadiene, butadiene-styrene copolymer, ethylene-propylene copolymer, and ethylene-propylene copolymer.
Diene copolymer, polyisoprene, polyisobutylene, polyacrylate, polyester,
Examples include polyurethane and various modified polymers thereof. Specific examples of rubber-modified styrene resins include butadiene-based rubber-modified polystyrene, butadiene-based rubber-modified styrene-acrylonitrile copolymer, acrylic rubber-modified polystyrene, acrylic rubber-modified styrene-acrylonitrile copolymer, and ethylene-propylene copolymer. Examples include polymer-modified polystyrene and ethylene-methyl methacrylate copolymer-modified polystyrene. Hereinafter, the method of the present invention will be explained in detail with reference to Examples, but the present invention is not limited thereto. Examples 1 to 7 Poly(2,6-dimethyl-
1,4-phenylene oxide) (intrinsic viscosity measured in chloroform: 0.55 d/g) and nylon-6,6 (manufactured by Toray Industries, Inc.), the specific compounds listed in Table 1 were added, and the The mixture was kneaded for 5 minutes at a temperature range of .degree. A Brabender Plastograph was used as a kneading device. The Izod impact value was measured to indicate mechanical strength, and the heat distortion temperature (HDT) was measured to indicate heat resistance. The results are shown in Table 1. Comparative Example 1 The results of melt-kneading the polyphenylene oxide and polyamide used in Example 1 without adding any specific compound are shown in Table 1 as Comparative Example 1.
【表】
表―1の結果から分るように、本発明に従うと
ころの特定化合物を添加したものは、比較例に比
して耐衝撃性が向上していることが明らかであ
る。
実施例 8〜11
実施例―1で用いたポリ―(2,6―ジメチル
―1,4―フエニレンオキシド)50重量部およ
び、各種の耐衝撃性ナイロン50重量部およびスミ
エポキシELA―1283重量部をドライブレンドし
た後、PCM―30型2軸押出機(東芝機械(株)製)
を用い、約270℃で、混練した。得られたペレツ
トからIzod衝撃試験片を作製し、衝撃値を測定し
た。又、比較例として、スミエポキシELA―128
を添加しない時も同様に処理し、衝撃値を測定し
た。これを比較例―2とする。結果を表―2に示
す。[Table] As can be seen from the results in Table 1, it is clear that the products to which the specific compound according to the present invention was added have improved impact resistance compared to the comparative example. Examples 8 to 11 50 parts by weight of poly(2,6-dimethyl-1,4-phenylene oxide) used in Example-1, 50 parts by weight of various impact-resistant nylons, and 1283 parts by weight of Sumiepoxy ELA-1 After dry blending, PCM-30 type twin screw extruder (manufactured by Toshiba Machine Co., Ltd.)
The mixture was kneaded at about 270°C. Izod impact test pieces were prepared from the obtained pellets and impact values were measured. Also, as a comparative example, Sumiepoxy ELA-128
The same treatment was carried out without the addition of , and the impact value was measured. This is referred to as Comparative Example-2. The results are shown in Table-2.
Claims (1)
ン原子、炭化水素もしくは置換炭化水素基であ
り、少なくとも1つは必ず水素である。) で表わされるフエノール化合物を1種又は2種以
上酸化重合して得られる重合体5〜95wt%およ
びポリアミド95〜5wt%からなる樹脂100重量部
に対し分子内にオキシラン環を有する化合物およ
び/または二価フエノールとエピクロロヒドリン
との縮合高分子量体0.1〜20重量部を加えてなる
樹脂組成物。[Claims] 1. General formula (In the formula, R 1 , R 2 , R 3 , R 4 , R 5 are hydrogen, halogen atoms, hydrocarbons or substituted hydrocarbon groups, and at least one is always hydrogen.) A compound having an oxirane ring in the molecule and/or dihydric phenol and epichlorohydride per 100 parts by weight of a resin consisting of 5 to 95 wt% of a polymer obtained by oxidative polymerization of one or more types and 95 to 5 wt% of polyamide. A resin composition containing 0.1 to 20 parts by weight of a condensed polymer with phosphorus.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12457479A JPS5647432A (en) | 1979-09-26 | 1979-09-26 | Resin composition |
US06/169,368 US4315086A (en) | 1979-08-08 | 1980-07-16 | Resin compositions |
CA000356575A CA1155583A (en) | 1979-08-08 | 1980-07-18 | Impact resistant blends of polyphenylene oxide and polyamide resins |
EP80302471A EP0024120B1 (en) | 1979-08-08 | 1980-07-21 | Resin compositions comprising polyphenylene oxide, polyamide and a compound improving the impact resistance |
DE8080302471T DE3062623D1 (en) | 1979-08-08 | 1980-07-21 | Resin compositions comprising polyphenylene oxide, polyamide and a compound improving the impact resistance |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12457479A JPS5647432A (en) | 1979-09-26 | 1979-09-26 | Resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5647432A JPS5647432A (en) | 1981-04-30 |
JPS638139B2 true JPS638139B2 (en) | 1988-02-20 |
Family
ID=14888838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12457479A Granted JPS5647432A (en) | 1979-08-08 | 1979-09-26 | Resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5647432A (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59188353U (en) * | 1983-06-02 | 1984-12-13 | 株式会社 荒井製作所 | mechanical seal |
DE3781066T2 (en) * | 1986-03-07 | 1993-04-01 | Gen Electric | COMPOSITIONS BASED ON POLYPHENYLENE ETHER AND POLYAMIDES WITH MODIFIED IMPACT RESISTANCE. |
JPS6348356A (en) * | 1986-08-19 | 1988-03-01 | Mitsubishi Petrochem Co Ltd | Flame-retardant polyphenylene ether composition |
US5237002A (en) * | 1986-10-31 | 1993-08-17 | Sumitomo Chemical Company, Limited | Thermoplastic resin composition |
JP2702486B2 (en) * | 1986-12-30 | 1998-01-21 | ゼネラル・エレクトリック・カンパニイ | Polymer blend containing polyamide, polyphenylene ether and impact modifier |
JP2702485B2 (en) * | 1986-12-30 | 1998-01-21 | ゼネラル・エレクトリック・カンパニイ | Polymer blend containing polyamide, polyphenylene ether and impact modifier |
JP2533323B2 (en) * | 1987-06-12 | 1996-09-11 | 住友化学工業株式会社 | Thermoplastic resin composition |
US5212256A (en) * | 1988-05-24 | 1993-05-18 | Sumitomo Chemical Co., Ltd. | Thermoplastic resin composition |
US5040446A (en) * | 1991-01-14 | 1991-08-20 | Latin Percussion, Inc. | Tambourine |
US8859672B2 (en) * | 2011-06-27 | 2014-10-14 | Sabic Global Technologies B.V. | Poly(arylene ether)-poly(hydroxy ether) block copolymer and method of making |
-
1979
- 1979-09-26 JP JP12457479A patent/JPS5647432A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5647432A (en) | 1981-04-30 |
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