JPS6380967A - Solder melting tank - Google Patents
Solder melting tankInfo
- Publication number
- JPS6380967A JPS6380967A JP22583086A JP22583086A JPS6380967A JP S6380967 A JPS6380967 A JP S6380967A JP 22583086 A JP22583086 A JP 22583086A JP 22583086 A JP22583086 A JP 22583086A JP S6380967 A JPS6380967 A JP S6380967A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- tank
- silicon nitride
- melting tank
- solder melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 35
- 238000002844 melting Methods 0.000 title claims abstract description 18
- 230000008018 melting Effects 0.000 title claims abstract description 18
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 13
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 13
- 230000037431 insertion Effects 0.000 claims abstract description 7
- 238000003780 insertion Methods 0.000 claims abstract description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 abstract description 2
- 239000012188 paraffin wax Substances 0.000 abstract description 2
- 239000000843 powder Substances 0.000 abstract description 2
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Coating With Molten Metal (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、耐食性および耐摩耗性に優れたはんだ溶融槽
に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a solder melting bath having excellent corrosion resistance and wear resistance.
（従来の技術）
電子部品等の自動はんだづけ装置では、直方体状で上面
開放のはんだ収容部とこのはんだ収容部の底部にヒータ
ー挿入用の孔を有する槽本体を、ステンレスで一体に形
成してなるはんだ溶融槽が使用されている。このはんだ
溶融槽では、はんだ収容部に収容したはんだを、ヒータ
ー挿入用の孔に挿入したヒーターにより加熱して、溶融
している。(Prior art) In automatic soldering equipment for electronic components, etc., a rectangular parallelepiped solder storage section with an open top and a tank body having a hole for inserting a heater at the bottom of the solder storage section are integrally formed of stainless steel. A solder melting bath is used. In this solder melting tank, the solder contained in the solder storage portion is heated and melted by a heater inserted into a heater insertion hole.
（発明が解決しようとする問題点）
しかしながら従来のステンレスにより形成されたはんだ
溶融槽では、ステンレス自体がはんだに浸蝕されやすく
、特にｙＪ造上、槽の肉厚を薄くする必要がある場合に
は、槽壁に亀裂やピンポールが発生しやすく、寿命が短
いという問題があった。(Problems to be Solved by the Invention) However, in conventional solder melting tanks made of stainless steel, the stainless steel itself is easily corroded by solder, especially when the wall thickness of the tank needs to be thinned due to the construction of YJ. However, there was a problem that cracks and pin poles were likely to occur on the tank wall, and the service life was short.
本発明はこのような問題を解決するためになされたもの
で、はんだに浸蝕されにくく、さらに槽壁の肉厚が薄く
ても亀裂やピンホールのような欠点を生じに＜＜、寿命
の長いはんだ溶融槽を提供することを目自勺とする。The present invention was made to solve these problems, and it has a long service life, is not easily corroded by solder, and does not cause defects such as cracks or pinholes even if the tank wall is thin. Our aim is to provide a solder melting tank.
［発明の構成〕
（問題点を解決するための手段）
本発明のはんだ溶融槽は、はんだ収容部を有し、このは
んだ収容部に近接してヒーター挿入部を有する槽本体を
、窒化ケイ素または炭化ケイ素により形成したことを特
徴としている。[Structure of the Invention] (Means for Solving the Problems) The solder melting bath of the present invention has a solder accommodating portion, and a bath body having a heater insertion portion adjacent to the solder accommodating portion is made of silicon nitride or It is characterized by being made of silicon carbide.
（作 用）
本発明において、窒化ケイ素および炭化ケイ素は、はん
だにぬれに＜＜、浸蝕されにくいため、特に槽壁が１１
１１程度と肉薄部を必要とするような場合でも、耐食性
および耐摩耗性に優れたはんだ溶融槽が得られる。また
、ヒーターによる加熱部は、５００〜６００℃と高温に
なるが、窒化ケイ素および炭化ケイ素は、耐熱衝撃性に
優れているなめ、破損や亀裂などの欠点を生じることも
ない。(Function) In the present invention, silicon nitride and silicon carbide are less likely to be wetted by solder and eroded.
Even in cases where a thin wall portion of about 11 is required, a solder melting tank with excellent corrosion resistance and wear resistance can be obtained. Furthermore, although the heated portion by the heater reaches a high temperature of 500 to 600° C., silicon nitride and silicon carbide have excellent thermal shock resistance, so defects such as breakage and cracks do not occur.
（実施例） 次に本発明の実施例について説明する。(Example) Next, examples of the present invention will be described.
実施例
まず平均粒径０．８μｍの窒化ケイ素（ＳｉｌＮ４）粉
末に焼結助剤として窒化ケイ素１００重量部に対して酸
化アルミニウム４重量部と酸化イツトリウム５重量部を
添加し、充分に混合した後、これにバインダとしてパラ
フィンを７重量部加えて、直方体状に成形し、次いでは
んだ収容部とヒーター挿入部とをｉ械加工により所定形
状にし、脱脂後１７８０℃で焼成して、図面に示すよう
な槽壁の一面の肉厚が１１で、ヒーター挿入部２が直径
１２ｍｍ Ｘ ６０ｎで、外径寸法が１００ｕ Ｘ ６
０ｍＩ Ｘ ６０ｕであるはんだ溶融ＷＪ１を形成した
。Example First, 4 parts by weight of aluminum oxide and 5 parts by weight of yttrium oxide were added to 100 parts by weight of silicon nitride as a sintering aid to silicon nitride (SilN4) powder with an average particle size of 0.8 μm, and after thorough mixing. To this, 7 parts by weight of paraffin was added as a binder, and it was formed into a rectangular parallelepiped shape.Then, the solder accommodating part and the heater inserting part were formed into a predetermined shape by i-machining, and after degreasing, they were fired at 1780°C, as shown in the drawing. The wall thickness of one side of the tank wall is 11mm, the heater insertion part 2 is 12mm in diameter x 60n, and the outer diameter is 100u x 6.
A solder melt WJ1 of 0 mI x 60 u was formed.
このはんだ溶融槽を用いて、はんだ６０八（２ｎ−３ｎ
系）を４５０°Ｃで溶融させた。Using this solder melting tank, solder 608 (2n-3n
system) was melted at 450°C.
また本発明との比較のため、従来のステンレス５ｔｌＳ
３０４により形成されたはんだ溶融槽を使用して実施
例と同一条件ではんだの溶融を行なった。Also, for comparison with the present invention, conventional stainless steel 5tlS
Solder was melted using a solder melting tank formed by No. 304 under the same conditions as in the example.
その結果、従来の５ＩＪＳ３０４を用いたはんだ溶融槽
は、約２５０時間で槽壁に亀裂を生じたが、本発明によ
る窒化ケイ素を用いたはんだ溶融槽は、約７５０時間の
使用後も、槽内壁表面やヒーター挿入部に亀裂やピンホ
ールのような欠点は認められなかった。As a result, the solder melting tank using conventional 5IJS304 developed cracks on the tank wall after about 250 hours, but the solder melting tank using silicon nitride according to the present invention showed cracks on the tank inner wall even after about 750 hours of use. No defects such as cracks or pinholes were observed on the surface or the heater insertion part.
なお、本実施例では、窒化ケイ素を使用したが、炭化ケ
イ素を用いても同等の効果が得られる。Although silicon nitride is used in this embodiment, the same effect can be obtained by using silicon carbide.
［発明の効果コ
以上説明したように本発明によれば、ヒーターをはんだ
収容部に近接した位置に挿入して用いるはんだ溶融槽に
おいて、槽壁が薄くても、ピンホールや亀裂の生じにく
い耐準耗性および耐浸触性に優れたはんだ溶融槽が得ら
れる。[Effects of the Invention] As explained above, according to the present invention, in a solder melting tank used by inserting a heater in a position close to a solder storage part, even if the tank wall is thin, pinholes and cracks do not easily occur. A solder melting bath with excellent semi-wear resistance and penetration resistance can be obtained.
図面は本発明の一実施例を示す斜視図である。 The drawing is a perspective view showing an embodiment of the present invention.
Claims (1)
てヒーター挿入部を有する槽本体を、窒化ケイ素または
炭化ケイ素により一体に形成してなることを特徴とする
はんだ溶融槽。(1) A solder melting tank characterized in that a tank body having a solder accommodating portion and a heater insertion portion adjacent to the solder accommodating portion is integrally formed of silicon nitride or silicon carbide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22583086A JPS6380967A (en) | 1986-09-26 | 1986-09-26 | Solder melting tank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22583086A JPS6380967A (en) | 1986-09-26 | 1986-09-26 | Solder melting tank |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6380967A true JPS6380967A (en) | 1988-04-11 |
Family
ID=16835474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22583086A Pending JPS6380967A (en) | 1986-09-26 | 1986-09-26 | Solder melting tank |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6380967A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012060887A (en) * | 2010-09-14 | 2012-03-29 | Zenri Tateyama | Marine organism-trapping basket |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5190958A (en) * | 1975-02-06 | 1976-08-10 | ||
| JPS5269849A (en) * | 1975-12-08 | 1977-06-10 | Tokyo Shibaura Electric Co | Corrosion resisting structures with corrosion resistance to burning melting |
| JPS52108353A (en) * | 1976-03-09 | 1977-09-10 | Asahi Glass Co Ltd | Ultrasonic soldering device |
| JPS55126989A (en) * | 1979-03-24 | 1980-10-01 | Kyoto Ceramic | Ceramic heater |
| JPS5640665B2 (en) * | 1976-08-14 | 1981-09-22 | ||
| JPS60120048A (en) * | 1983-12-02 | 1985-06-27 | 株式会社東芝 | Coupling jig |
-
1986
- 1986-09-26 JP JP22583086A patent/JPS6380967A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5190958A (en) * | 1975-02-06 | 1976-08-10 | ||
| JPS5269849A (en) * | 1975-12-08 | 1977-06-10 | Tokyo Shibaura Electric Co | Corrosion resisting structures with corrosion resistance to burning melting |
| JPS52108353A (en) * | 1976-03-09 | 1977-09-10 | Asahi Glass Co Ltd | Ultrasonic soldering device |
| JPS5640665B2 (en) * | 1976-08-14 | 1981-09-22 | ||
| JPS55126989A (en) * | 1979-03-24 | 1980-10-01 | Kyoto Ceramic | Ceramic heater |
| JPS60120048A (en) * | 1983-12-02 | 1985-06-27 | 株式会社東芝 | Coupling jig |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012060887A (en) * | 2010-09-14 | 2012-03-29 | Zenri Tateyama | Marine organism-trapping basket |
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