JPS6379670U - - Google Patents
Info
- Publication number
- JPS6379670U JPS6379670U JP17387086U JP17387086U JPS6379670U JP S6379670 U JPS6379670 U JP S6379670U JP 17387086 U JP17387086 U JP 17387086U JP 17387086 U JP17387086 U JP 17387086U JP S6379670 U JPS6379670 U JP S6379670U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- board according
- magnetic material
- molding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012778 molding material Substances 0.000 claims description 4
- 229910000859 α-Fe Inorganic materials 0.000 claims description 3
- 239000000696 magnetic material Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17387086U JPS6379670U (is) | 1986-11-12 | 1986-11-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17387086U JPS6379670U (is) | 1986-11-12 | 1986-11-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6379670U true JPS6379670U (is) | 1988-05-26 |
Family
ID=31111736
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17387086U Pending JPS6379670U (is) | 1986-11-12 | 1986-11-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6379670U (is) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07245495A (ja) * | 1994-03-03 | 1995-09-19 | Cmk Corp | 絶縁層に磁性体材料を含有させたプリント配線板用素 材 |
-
1986
- 1986-11-12 JP JP17387086U patent/JPS6379670U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07245495A (ja) * | 1994-03-03 | 1995-09-19 | Cmk Corp | 絶縁層に磁性体材料を含有させたプリント配線板用素 材 |