JPS6379652U - - Google Patents
Info
- Publication number
- JPS6379652U JPS6379652U JP17416986U JP17416986U JPS6379652U JP S6379652 U JPS6379652 U JP S6379652U JP 17416986 U JP17416986 U JP 17416986U JP 17416986 U JP17416986 U JP 17416986U JP S6379652 U JPS6379652 U JP S6379652U
- Authority
- JP
- Japan
- Prior art keywords
- wide part
- lead frame
- hole
- die pad
- bored
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17416986U JPS6379652U (hu) | 1986-11-13 | 1986-11-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17416986U JPS6379652U (hu) | 1986-11-13 | 1986-11-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6379652U true JPS6379652U (hu) | 1988-05-26 |
Family
ID=31112311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17416986U Pending JPS6379652U (hu) | 1986-11-13 | 1986-11-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6379652U (hu) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03211867A (ja) * | 1990-01-17 | 1991-09-17 | Matsushita Electron Corp | 半導体装置用リードフレーム |
-
1986
- 1986-11-13 JP JP17416986U patent/JPS6379652U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03211867A (ja) * | 1990-01-17 | 1991-09-17 | Matsushita Electron Corp | 半導体装置用リードフレーム |