JPS6379636U - - Google Patents
Info
- Publication number
- JPS6379636U JPS6379636U JP17522486U JP17522486U JPS6379636U JP S6379636 U JPS6379636 U JP S6379636U JP 17522486 U JP17522486 U JP 17522486U JP 17522486 U JP17522486 U JP 17522486U JP S6379636 U JPS6379636 U JP S6379636U
- Authority
- JP
- Japan
- Prior art keywords
- processed
- substrate
- heating temperature
- predetermined heating
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Drying Of Solid Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17522486U JPS6379636U (US20100056889A1-20100304-C00004.png) | 1986-11-13 | 1986-11-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17522486U JPS6379636U (US20100056889A1-20100304-C00004.png) | 1986-11-13 | 1986-11-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6379636U true JPS6379636U (US20100056889A1-20100304-C00004.png) | 1988-05-26 |
Family
ID=31114349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17522486U Pending JPS6379636U (US20100056889A1-20100304-C00004.png) | 1986-11-13 | 1986-11-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6379636U (US20100056889A1-20100304-C00004.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000243687A (ja) * | 1999-02-19 | 2000-09-08 | Tokyo Electron Ltd | 基板温調装置、基板温調方法、基板処理装置及び基板処理方法 |
| JP2012231001A (ja) * | 2011-04-26 | 2012-11-22 | Hitachi Kokusai Electric Inc | 基板処理装置及び半導体装置の製造方法 |
| US9236246B2 (en) | 2011-03-04 | 2016-01-12 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and a method of manufacturing a semiconductor device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737848A (en) * | 1980-08-19 | 1982-03-02 | Toshiba Corp | Heating apparatus for wafer |
| JPS61147528A (ja) * | 1984-12-21 | 1986-07-05 | Toshiba Corp | レジスト処理装置 |
-
1986
- 1986-11-13 JP JP17522486U patent/JPS6379636U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737848A (en) * | 1980-08-19 | 1982-03-02 | Toshiba Corp | Heating apparatus for wafer |
| JPS61147528A (ja) * | 1984-12-21 | 1986-07-05 | Toshiba Corp | レジスト処理装置 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000243687A (ja) * | 1999-02-19 | 2000-09-08 | Tokyo Electron Ltd | 基板温調装置、基板温調方法、基板処理装置及び基板処理方法 |
| US9236246B2 (en) | 2011-03-04 | 2016-01-12 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and a method of manufacturing a semiconductor device |
| US9472424B2 (en) | 2011-03-04 | 2016-10-18 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and a method of manufacturing a semiconductor device |
| JP2012231001A (ja) * | 2011-04-26 | 2012-11-22 | Hitachi Kokusai Electric Inc | 基板処理装置及び半導体装置の製造方法 |
